UMAX 91302-32-067RDM
Product Overview
This specification covers the performance, tests, and quality requirements for the PCI Express M.2 connector. The product is designed to meet electrical, mechanical, and environmental performance requirements.
| Specification | Requirement | Procedure |
|---|---|---|
| Working Voltage (per pin) | < 36 VAC | - |
| Voltage (per pin) | 50 VAC | - |
| Current (per pin) | 0.5 Amperes | - |
| Operating Temperature | -40C to 80C | - |
| Low Level Contact Resistance (Initial) | 55 m max. | EIA-364-23 |
| Low Level Contact Resistance (Final) | 20 m max. change allowed | EIA-364-23 |
| Insulation Resistance | 500 M min. | EIA-364-21 |
| Dielectric Withstanding Voltage | No Breakdown (Current leakage: 1 mA max.) | EIA-364-20 (300V AC min. at sea level for 1 minute) |
| Mating Force | 2.55 Kgf Max. | EIA-364-13, Method A |
| Reseating | Appearance: No damage | Manually mated/unmated the connector or socket perform 3 cycles. |
| Durability (Au plating) | 60 mate/unmate cycles (15" & 30" Au plating) | EIA-364-09 |
| Durability (Gold flash plating) | 25 mate/unmate cycles | EIA-364-09 |
| Durability (precondition) | No evidence of physical damage | EIA-364-09 (5 mate/unmate cycles) |
| Temperature Rise | 0.5A / power contact with 30 C MAX. change allowed | EIA-364-70, Method 2 |
| Vibration | 1.0 microsecond max. | EIA-364-28, Condition VII, Condition letter D |
| Shock (Mechanical) | 1.0 microsecond max. | 250 G (Ultrabook) and 285 G (Tablet) at 2 milliseconds half sine on all six axis. |
| Cyclic Temperature & Humidity | See Product Qualification and Test Sequence Group 2 | EIA-364-31, Method III |
| Thermal Shock | See Product Qualification and Test Sequence Group 2 | EIA-364-32, method A test condition I |
| Temperature Life | See Product Qualification and Test Sequence Group 1 | EIA-364-17, method A (105C for 120 hours) |
| Temperature Life (precondition) | No physical damage | EIA-364-17, method A (105C for 72 hours) |
| MFG | No physical damage and functional failed | EIA-364-65 class IIA (7 days to simulate a 5 year field life) |
| Thermal Disturbance | See Product Qualification and Test Sequence Group 8 | 10 cycles (153C to 853C) |
| Solderability (Tin plating) | Min. of 95% solder coverage | EIA-364-52 (2455C, for 4-5 sec.) |
| Solderability (Gold plating) | Min. of 75% solder coverage | EIA-364-52 (2455C, for 4-5 sec.) |
| Hand Soldering Resistance | Appearance: No damage | T350C, 3 sec. at least. |
| Resistance to reflow soldering heat | See Product Qualification and Test Sequence Group 10 (Lead Free) | Pre Heat: 150~180C, 60~120 sec. Heat: 230C Min., 40 sec. Min. Peak Temp.: 260C Max., 10 sec. Max. (2 reflow cycles) |
| Test or Examination | Group 1 | Group 2 | Group 3 | Group 4 | Group 5 | Group 6 | Group 7 | Group 8 | Group 9 | Group 10 |
|---|---|---|---|---|---|---|---|---|---|---|
| Examination of product | 1, 6, 9 | 1, 6, 9, 12 | 1, 6, 9 | 1, 7 | 1, 4 | 1, 3 | 1, 7 | 1, 12 | 1, 3 | 1, 3 |
| Low level contact resistance | 2, 5, 8 | 2, 5, 8, 11 | 2, 5, 8 | 2, 6 | 2, 4, 6 | 2, 5, 7, 9, 11 | - | - | - | - |
| Insulation resistance | 2 | - | - | - | - | - | - | - | - | - |
| Dielectric withstanding voltage | 3 | - | - | - | - | - | - | - | - | - |
| Mating / Unmating Force | 3, 5 | - | - | - | - | - | - | - | - | - |
| Durability | 4 | - | - | - | - | - | - | - | - | - |
| Durability (precondition) | 3 | 3 | 3 | 3 | 3 | - | - | - | - | - |
| Temperature Rise | - | - | - | - | - | - | - | - | - | - |
| Vibration | - | - | - | - | - | - | - | - | - | - |
| Shock (Mechanical) | 5 | - | - | - | - | - | - | - | - | - |
| Reseating | - | - | - | - | - | - | - | - | - | - |
| Thermal Shock | - | 4 | - | - | - | - | - | - | - | - |
| Cyclic Temperature & Humidity | - | 7 | - | - | - | - | - | - | - | - |
| Temperature Life | - | 4 | - | 4 | - | - | - | - | - | - |
| Temperature Life (precondition) | - | 4 | - | 4 | - | - | - | - | - | - |
| MFG | - | - | - | - | - | 6 | - | - | - | - |
| Solderability | - | - | 2 | - | - | - | - | - | - | - |
| Thermal Disturbance | - | - | - | - | - | - | 8 | - | - | - |
| Resistance to reflow soldering heat | - | - | - | - | - | 2 | - | - | - | - |
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