Samtec UMPT-04-01-T-RA-WT-TR
Ultra Micro Power Terminal (UMPT)
The Ultra Micro Power Terminal system features a 2.00 mm pitch, designed for board-to-board, cable-to-board, and cable-to-cable applications. It supports up to 18 A per blade and offers vertical and right-angle orientations with stack heights ranging from 5 mm to 20 mm. The system includes options for weld tabs and latching mechanisms (plastic top or metal side) for secure connections in severe environments.
| Position | Dim A (mm) | Dim B (mm) |
|---|---|---|
| 02 | 11.30 | 9.70 |
| 03 | 13.30 | 11.70 |
| 04 | 15.30 | 13.70 |
| 05 | 17.30 | 15.70 |
| 06 | 19.30 | 17.70 |
| 07 | 21.30 | 19.70 |
| 08 | 23.30 | 21.70 |
| 09 | 25.30 | 23.70 |
| 10 | 27.30 | 25.70 |
TE Connectivity 1982299-4
Product OverviewProduct Name: Housing, Receptacle, Wire-to-Board, 2 Position, 7.8 mm [.307 in] Centerline, Wire & Cable, UL 94V-0, ELCON Mini, Rectangular Power ConnectorsDescription: This is a 2-position wire-to-board receptacle housing for power connectors, featuring a 7.8 mm [.307 in] centerline. ...
Anderson Power 1327FP-BK
Product Overview Anderson Power Products' SPEC Pak Connector Series offers rugged, environmentally sealed (IP68) shells designed to protect existing APP Powerpole contacts and housings. These customer-configurable connectors are ideal for high-power interconnects with signal and ground capabilities ...
Anderson Power 5915-BK
Product Overview The Anderson Power Products SPEC Pak Sealed Power connectors are rugged, environmentally sealed (IP68) interconnect solutions designed for high-power applications in harsh environments. These connectors are customer-configurable, offering thousands of design options to meet specific ...
TE Connectivity 5787531-1
Product Details This document outlines the specifications for a connector assembly, including its housing, contact material, plating, and recommended PCB mounting dimensions. It is designed for applications requiring reliable electrical connections with specific mating and soldering requirements. ...
