HRS BM29B-2DP/2-0.35V(51)
BM29 Series
Ultra-small, power/signal contact design for Board-to-Board/FPC-to-Board providing 3A max current.
Brand
HIROSE ELECTRIC
Series
BM29
Product Type
Board-to-Board / FPC-to-Board Connector
Contact Type
Power and Signal
Max Current Rating
3A (Power Contact)
Material (Insulator)
LCP (UL94V-0)
Material (Signal Contact)
Phosphor Bronze
Material (Power Contact)
Phosphor Bronze
Plating (Signal Contact)
Gold Plated
Color
Black
Certifications
UL94V-0
| Item | Specifications | Conditions |
|---|---|---|
| Rated Current (Power Contact) | 3A | |
| Rated Current (Signal Contact) | 0.3A | |
| Rated Voltage | 80V AC/DC | |
| Insulation Resistance | Minimum of 1000M | Measured at 100V DC |
| Withstanding Voltage | There shall be no flashover or dielectric breakdown. | 150V AC for 1 minute |
| Contact Resistance (Signal Contact) | 100m max. | Measured at 20mV AC, 1kHz, and 1mA |
| Contact Resistance (Power Contact) | 30m max. | Measured at 20mV AC, 1kHz, and 1mA |
| Vibration Resistance | There shall be no instantaneous power failure lasting for a minimum of 1s. | Frequency: 10 to 55 Hz, Half amplitude: 0.75mm, in 3 axis directions for 10 cycles each (5 minutes/cycle) |
| Moisture Resistance (Contact Resistance) | Signal contact: 100m max. Power contact: 30m max. | Temperature: 402C, Humidity: 90 to 95%, left as it is for 96 hours |
| Moisture Resistance (Insulation Resistance) | 100M min. | Temperature: 402C, Humidity: 90 to 95%, left as it is for 96 hours |
| Temperature Cycle (Contact Resistance) | Signal contact: 100m max. Power contact: 30m max. | (-55C for 30 minutes 5 to 35C for 10 minutes 85C for 30 minutes 5 to 35C for 10 minutes) in 5 cycles |
| Temperature Cycle (Insulation Resistance) | 100M min. | (-55C for 30 minutes 5 to 35C for 10 minutes 85C for 30 minutes 5 to 35C for 10 minutes) in 5 cycles |
| Mating Durability | Contact resistance: 100m max. | Mating times: 10 times |
| Soldering Heat Resistance (Reflow) | There shall be no dissolution of the resin part affecting the performance. | According to the Recommended temperature profile |
| Soldering Heat Resistance (Hand Soldering) | There shall be no dissolution of the resin part affecting the performance. | Temperature of soldering iron at 350C for within 3 seconds |
| Operation Temperature Range | -40 to 85C (Note 1) | |
| Storage Temperature Range | -10 to 60C (Note 2) | |
| Operation Humidity Range | 90% RH or below (Note 3) | |
| Storage Humidity Range | 90% RH or below (Notes 2 and 3) |
| Product Number Structure (Receptacle) | Series Name | Series No. | Connector Type | Number of Power Contacts | Stacking Height | Contact Pitch | Number of Signal Contacts | Terminal Shape | Packaging |
|---|---|---|---|---|---|---|---|---|---|
| BM 29B - % DP/ 2 - 0.35 V | BM | 29B | Receptacle | 2 | 0.35mm | 2, 4, 6, 24 | V : Straight | (51) Emboss tape packaging (20,000 pcs/reel) (53) Emboss tape packaging (1,000 pcs/reel) SMT (1,000 pcs/reel) |
| Product Number Structure (Header) | Series Name | Series No. | Contact Pitch | Number of Signal Contacts | Connector Type | Number of Power Contacts | Terminal Shape | Packaging |
|---|---|---|---|---|---|---|---|---|
| BM 29B - % DP/ 2 - 0.35 V | BM | 29B | 0.35mm | 2, 4, 6, 24 | Header | 2 | V : Straight SMT | (51) Emboss tape packaging (20,000 pcs/reel) (53) Emboss tape packaging (1,000 pcs/reel) |
Precautions
1. Recommended temperature profile: MAX 250C. Conditions: Peak temperature 250C, Heating unit: No less than 220C for no more than 60 seconds, Preheating unit: 150 to 180C for 90 to 120 seconds, Number of times: No more than 2 times. Note 1: Temperature is PCB surface temperature near connector lead. Note 2: Use nitrogen reflow with oxygen concentration at a minimum of 1,000 [ppm].
2. Recommended hand soldering conditions: Soldering iron temperature: 340 10C, Soldering time: within 3 seconds.
3. Recommended screen thickness/aperture ratio: Thickness: 0.1mm. Aperture ratio: 100% on DS side; 80% on DP side.
4. Warpage of the PCB: A maximum of 0.02mm at the center part of the connector based on both ends.
5. Cleaning: Not recommended. If cleaning is performed, evaluate performance beforehand. Cleaning may affect mating/unmating property and resistance to environment.
6. Notes:
- Care should be taken that mating/unmating operation when the product is not mounted on the PCB could cause damage or deformation, etc. of the contact.
- Avoid supporting the PCB only by connectors; support it by other means.
- Care should be taken that excessive prying mating/unmating could cause damage.
- During hand soldering, do not apply flux which will cause flux oozing on connector.
- This product may differ in hue due to production lot variability, but it doesnt have any influence on the performance.
- Please refer to the next page for the precautions for mating/unmating.
- Considering the possibility of disengagement due to counterforce caused by drop, impact, and routing of FPC, fix the mated state by using housings and cushion materials, etc.
- Caution! Do not use the connector in non-recommended conditions (i.e., rated current, rated voltage, PCB design and operating environment, etc.). Such usage could lead to material outgassing, ignition, or short-circuit, etc.
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