JUSHUO AFC10-S04QCA-00
Product Overview
Product Name: WAFER (WAFER Patch Socket)
Description: 1.0mm pitch wafer patch socket connectors.
Scope: This specification is applicable to 1.0mm pitch WAFER patch socket connectors.
Use: Suitable for FPC/FFC mating.
Environmental Protection: Products comply with ROHS environmental requirements.
| Item | Specification | Requirement |
|---|---|---|
| Rated Voltage (MAX) | 50V | |
| Rated Current (MAX) | [AC/DC (Virtual value) 50Hz] | 0.5A |
| Ambient Temperature Range | (Including terminal temperature rise) | -45 +85 |
| Item | Part Name | Model | Material |
|---|---|---|---|
| Base | Base | AFC10-S**QCA-00 | LCP E130i |
| Pin | Pin | AFC10-S**QCA-00 | Phosphor copper |
| Stator | Fixed piece | AFC10-S**QCA-00 | Phosphor copper |
| Item | Test Condition | Requirement |
|---|---|---|
| Contact Resistance | Plug in the connector and test with a contact resistance meter to measure both terminals of the connector form a closed loop between. | 20 m MAX |
| Insulation Resistance | Plug in the connector and apply 500V DC voltage between the adjacent contacts and between the contacts and the enclosure for 1 minute. | 500M MIN |
| Dielectric Strength | Mate applicable FPC/FFC and apply 200V AC (virtual value) for 1 minute between adjacent terminals or ground. | No Breakdown |
| Pin fixing force | Fix the pin holder on the drawing machine and apply force on the front end of the pin at a rate of 253mm per minute until the pin is withdrawn from the pin holder. | Single pin: 5N MIN |
| Terminal Retention in Plastic parts | The terminal shall be matched with the hole seat, and at the rate of 253mm per minute along the conductor direction, the force that the terminal is pulled out of the socket. | Single terminal: 5N MIN |
| Heat Resistance | Place the connector in an environment of +852 for 96H, take it out and test after 1-2H in normal environment. | Appearance: No Damage; Contact Resistance: 30 m MAX |
| Cold Resistance | Place the connector in an environment of -452 for 96H, take it out and test after 1-2H in normal environment. | Appearance: No Damage; Contact Resistance: 30 m MAX |
| Humidity | Place the connector in an environment of 452, relative humidity 90~96% for 96H. After the test, take it out and test after 1-2H in normal environment. | Appearance: No Damage; Contact Resistance: 50 m MAX; Insulation Resistance: 30 M MIN; Dielectric Strength: No Breakdown |
| Temperature Cycling | Place the test samples in the high and low temperature test chamber and adjust the temperature according to the following steps: a) Maintain at -453 for 30 minutes; b) Maintain at normal temperature for 1H; c) Maintain at 853 for 30 minutes; d) Maintain at normal temperature for 1H; a to d is one cycle, a total of 5 cycles. After recovering in normal environment for 2H, inspect. | Appearance: No Damage; Contact Resistance: 60 m MAX |
| Salt Spray Resistance | Suspend the test sample from the top of the test chamber; spray with 5 1% salt water at 452 for 48 hours; wash with normal temperature water after the test; then dry at room temperature. | Appearance: No Damage, Corrosion; Contact Resistance: 30 m MAX |
| Solder Ability | Dip the sample's soldering surface into a tin bath at 2455 for 2.50.5 sec. | Tin Area: Above 95%; Appearance: No Damage |
| Soldering Resistance | Place the connector on a PCB board and immerse it in a tin bath at 2605 for 50.5 sec. | Tin Area: Above 95%; Appearance: No Damage, Deformation |
| Item | Appearance | Size |
|---|---|---|
| General | The surface of plastic parts shall be free of obvious scars, mottled, cracked, burr, flash, lack of material and deformation affecting the use; the surface of metal parts shall be smooth and clean, no rust, oxidation, peeling, blackening and obvious mechanical damage. | Reference engineering drawing |
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