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hanxia HX-XH2.54-2PZZ
hanxia HX-XH2.54-2PZZ
Manufacturer:hanxia
Model Number:HX-XH2.54-2PZZ
Minimum Order Quantity:5
Standard Packaging:Through Hole,P=2.5mm
Delivery Time:1 working day
Product Details
Flame Retardant Rating:
UL94V-0
Reference Series:
XH
Pins Structure:
1x2P
Contact Plating:
Tin
Contact Material:
Brass;PA66
Pitch:
2.54mm
Voltage Rating (Max):
250V
Number Of PINs Per Row:
2
Number Of Rows:
1
Operating Temperature:
-25℃~+85℃
Mounting Type:
Through Hole
Product Description
Detailed Specifications & Features
Product Overview
Scope: This specification covers the production and inspection of Connectors.
Usage Condition:
- Ambient temperature Range: -25C to +85C
- Applicable PC board thickness: 1.2mm to 1.6mm
Appearance and Dimension:
- Appearance: Product surface without defects, dirt, cracks, or mechanical damage. Contacts without rust, plating not oxidized and not peeled.
- Dimension: According to drawings.
- Exchangable: Exchangable with same specification products.
Material
| Type | Material | Finish | Explain |
|---|---|---|---|
| Terminal Contact | Phosphor bronze | Tin Plating | 3~4 m |
| Housing | Nylon66 | UL94V-0 | Color: White |
| Contact | Phosphor bronze | Tin Plating | 3~4 m, 0.15mm |
| Housing | Nylon66 | UL94V-0 | Color: White |
| Contact | Phosphor bronze | Tin Plating | 3~4 m |
| Opening Wafer | Plastic | Nylon66 | UL94V-0, Color: Beige |
| Contact | Phosphor bronze | Gold Plating | 3~4 m, 0.30mm |
| Lips Wafer | Plastic | PBT | UL94V-0, Color: White |
| Contact | Phosphor bronze | Tin Plating | 3~4 m, 0.30mm |
| Tiepian Wafer | - | - | - |
| Solder lugs | Phosphor bronze | Tin Plating | 3~4 m, 0.25mm |
| Wafer | - | - | Plastic, Color: Beige |
| Housing | Nylon46 | UL94V-0 | - |
| Item | Requirement | Condition |
|---|---|---|
| Heat test | Appearance: NO Damage Contact resistance: <20m | Time: 96h, Temperature: +853C |
| Cold test | Appearance: NO Damage Contact resistance: <20m | Time: 48h, Temperature: -253C |
| Temperature Cycling | Appearance: NO Damage Contact resistance: <20m | Low temp: -253C, High temp: 853C, 5 cycles. Test after keeping in Normal Condition for 30 min. |
| Invariableness humidity | Appearance: NO Damage Contact resistance: <20m Insulation Resistance: 100M | Temperature: 602C, Relative humidity: 90%-96% RH, Time: 96h |
| Salt Spray | Appearance: NO Damage Contact resistance: <20m | Salt concentration: 51%, Temperature: 352C, Time: 162h. After salt is removed by running wafer and a drop is removed, it is measured. |
| NO. | Item | Requirement |
|---|---|---|
| 5.1 | Voltage Rated | 250V AC/DC |
| Current Rated | 3A AC/DC | |
| Contact Resistance | <20m | |
| Insulation Resistance | 100M | |
| Dielectric Strength | 1000V AC/minute |
| NO. | Item | Requirement |
|---|---|---|
| 6.1 | Male contact Retention force | 10N per pin |
| 6.2 | Female contact Retention force | 10N per pin |
| 6.3 | Plug-in force | 3N per pin |
| 6.4 | Plug-out force | 0.5N per pin |
| NO. | Item | Requirement | Condition |
|---|---|---|---|
| Soldering rest | Area of Soldering: 95% | Time: 2.50.5S, Temperature: 2305C | |
| Resistance to soldering Heat | Appearance: NO Damage | Time: 51S, Temperature: 2305C |
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