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SHETIME WAF03-T1T1-2021-D
SHETIME WAF03-T1T1-2021-D
Manufacturer:SHETIME
Model Number:WAF03-T1T1-2021-D
Minimum Order Quantity:2000
Standard Packaging:SMD,P=1.25mm,Surface Mount,Right Angle
Delivery Time:3-5 working days
Product Details
Y-Width Of Bottom Edge On Board:
5.45mm
Contact Material:
Copper;LCP
Color:
Beige
Flame Retardant Rating:
UL94V-0
Number Of Rows:
1
Mounting Type:
Surface Mount, Right Angle
Pitch:
1.25mm
Number Of PINs:
3P
Operating Temperature:
-25℃~+85℃
Number Of PINs Per Row:
3
Current Rating:
1A
Contact Plating:
Tin
Voltage Rating (Max):
125V
X-Length Of Bottom Edge On Board (Spacing Line):
8.45mm
Z-Height Of The Board:
3.45mm
Product Description
Detailed Specifications & Features
Product Overview
This section details the testing and endurance characteristics of the product, ensuring its reliability under various conditions. It covers durability, contact resistance, vibration resistance, thermal aging, insulation resistance, and mechanical performance, including terminal crimping strength, insertion and withdrawal forces, and pin retention.
Technical Specifications
| Item | Test Mode | Requirement | Details |
|---|---|---|---|
| Durability | Mate connectors up to 30 cycles at a maximum rate of 10 cycles per minute prior to environmental test | N/A | N/A |
| Contact Resistance | N/A | <30m | N/A |
| Vibration | Connector combination state of the welding circuit board as test samples, resistance to vibration test | Discontinuous current (off): 1 micro second Max | Frequency: 10-55-10 Hz/minute, Amplitude: 1.5mm p-p, Direction: Axis of up and down, right/left, front/back, Period: 2 hours for each direction |
| Appearance | N/A | No damage | N/A |
| Contact Resistance | N/A | <30m | N/A |
| Thermal Aging | Connector combination condition is placed in the oven, high temperature aging test | Appearance: No damage, Contact Resistance: <30m | Temperature: 85 2 C, Period: 96 hours continuously |
| Insulation Resistance | Apply 500V DC (rms) for 1 minute between adjacent contacts | > 100 M | N/A |
| Terminal crimping wire strength | AWG#28 wire, pullout force | > 13N | Rate: 25 3mm per minute |
| Terminal crimping wire strength | AWG#30 wire, pullout force | > 8N | Rate: 25 3mm per minute |
| Terminal crimping wire strength | AWG#32 wire, pullout force | > 6N | Rate: 25 3mm per minute |
| Fixed terminals and hole seat | Terminal and hole seat pulled out from the hole | > 8N (Per contact) | Rate: 25 3mm along the wire direction |
| Single contact insertion force | Housing with terminal ends matched with Wafer, inserting force test | < 2N | Rate: 25 3mm per minute |
| Single contact withdrawal force | Housing with terminal ends matched with Wafer, pull-out test | > 0.2N | Rate: 25 3mm per minute |
| Pin Retention force | Force exerted on the pin end until exit from seat | > 3N (Per contact) | Rate: 25 3mm per minute |
| Temperature Rise | Mate connector measure temperature rise of contact at maximum rated current | 51C | N/A |
| Humidity | Connector combination under constant temperature and humidity | Appearance: No damage, Contact Resistance: <30m, Insulation Resistance: 50M, Withstand Voltage: No breakdown or flashover | Temperature: 40 2 C, Relative humidity: 90-95%RH, Period: 96 hours continuously |
| Temperature cycling | Thermal shock test | Same as paragraph 8.3 (Contact Resistance: <30m, Insulation Resistance: 50M, Withstand Voltage: No breakdown or flashover) | One cycle: -55+3C (30min), Room temp. (10-15 min), 85+3C (30min), Room temp. (10-15 min). Total cycle: 5 cycles. |
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