Hanbo Electronic WAFER-PH200DZ
Product Overview
This product is a connector component designed for electronic applications. It features a brass contact material with tin plating over nickel, and a PA66 (UL94V-0) housing. Key technical specifications include low contact resistance, high insulation resistance, and a rated voltage and current suitable for general electronic use. The product is designed for PCB mounting and meets environmental standards regarding hazardous substances.
Technical Specifications
| Item | Description | Material | Plating | Specifications |
|---|---|---|---|---|
| 1 | Base/Wafer | PA66 (UL94V-0) | - | White |
| 2 | Terminal/Contact | Brass | Nickel underplate, Tin plating (30U"MIN, Re-tin 80U"MIN) | - |
| - | Contact Resistance | - | - | 10m |
| - | Insulation Resistance | - | - | 1000M |
| - | Rated Voltage | - | - | 250V AC/DC |
| - | Rated Current | - | - | 2.0A AC/DC |
| - | Withstand Voltage | - | - | 1000V AC/Minute |
| - | Operating Temperature | - | - | -25C to +85C |
| - | Solderability Test | - | - | Immersion area 95%, Temp: 2355C, Time: 2.50.5 sec |
| - | Hazardous Substances | - | - | Compliant with environmental requirements (e.g., Lead, Cadmium) |
PCB Layout Information
| Dimension | Value |
|---|---|
| A | 0.15 mm |
| B | 0.2 mm |
| C | 0.20 mm |
| PCB Pad Size | 0.5*0.50 mm |
| Pitch | 2.000.10 mm |
| Mounting Hole Diameter | 0.500.03 mm |
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