Hanbo Electronic WAFER-XH254JK-5A
Product Overview
This product features plating with a nickel underlayer and tin plating on the entire surface. It utilizes a brass contact material and LCP/PA66 (UL94V-0) for the base/wafer. The plastic parts are designed to be smooth, free of burrs, significant shrinkage, defects, or cracks. It includes a locking window mechanism.
Base/Wafer Material
LCP/PA66 (UL94V-0)
Contact Material
Brass
Plating (Tin)
Nickel Underplating (Entire Surface), Tin Plating (80" MIN)
Color
White
| Item | Base/Wafer | Contact | Material | Plating (Tin) | Color |
|---|---|---|---|---|---|
| 1 | 30U"MIN 80UMIN | ||||
| 2 | /Wafer | /Contact | 30U"MIN 80UMIN |
| Technical Parameters | Value |
|---|---|
| Spacing | |
| Temperature Range | |
| Rated Voltage | |
| Rated Current | |
| Contact Resistance | |
| Insulation Resistance | |
| Withstand Voltage | |
| Locking Window | for N pieces, for N pieces |
| Suction Cover at Different Positions | Normal phenomenon with varying extraction force. |
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