Hanbo Electronic WAFER-XH254JK-6A
Product Overview
This product features plating with a nickel underlayer and a tin top layer on the entire surface. It is designed with a brass terminal/contact and a LCP/PA66 (UL94V-0) base/wafer. The plastic parts are characterized by a smooth surface, free from burrs, significant shrinkage, defects, or cracks. The locking window has specific requirements for the number of positions. Variations in extraction force due to different positions are normal.
Material (Terminal/Contact)
Brass
Plating (Terminal/Contact)
30U"MIN Nickel Underplate, 80UMIN Tin Plating
Material (Base/Wafer)
LCP/PA66 (UL94V-0)
Color (Base/Wafer)
White
| Item | Base/Wafer | Terminal/Contact | Material (Base/Wafer) | Material (Terminal/Contact) | Plating (Base/Wafer) | Plating (Terminal/Contact) |
|---|---|---|---|---|---|---|
| 1 | Base/Wafer | Terminal/Contact | LCP/PA66 (UL94V-0) | Brass | Nickel Underplate | 30U"MIN Tin Plating 80UMIN |
| 2 | Base/Wafer | Terminal/Contact | LCP/PA66 (UL94V-0) | Brass | Nickel Underplate | 30U"MIN Tin Plating 80UMIN |
| Specification | Value |
|---|---|
| Pitch | |
| Temperature Range | ~ |
| Rated Voltage | |
| Rated Current | |
| Contact Resistance | |
| Insulation Resistance | |
| Withstand Voltage | |
| Locking Window Positions | ~ (for X positions), (for Y positions) |
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