SHOU HAN 1.0-4P WT
Product Overview
This specification covers the production and inspection of a series of "1.0-4P WT" connectors. These connectors are designed for various applications requiring reliable electrical connections. They feature robust materials, precise plating, and meet stringent mechanical and electrical performance standards, ensuring durability and consistent performance across a wide temperature range.
Product Attributes
- Brand: (SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD)
- Origin: China
- Housing Material: LCP (UL94V-0)
- Housing Color: Natural or Black
- Contact Material: Phosphor Bronze
- Plating: Bright Tin (60u"MIN) or Gold Plating (3-4m)
- Certifications: RoHS Compliant
Technical Specifications
| Part No. | Description | Material | Plating | Dimensions (mm) | Rated Voltage | Rated Current | Contact Resistance | Insulation Resistance | Dielectric Strength |
| 1.0-4P WT Series | Connector Housing | LCP (UL94V-0) | N/A | Refer to Drawing | 125V AC/DC | 1A | ≤0.02Ω | ≥100MΩ | 500V AC/minute |
| Fitting Nail | Phosphor Bronze | Bright Tin (60u"MIN) | Refer to Drawing | ||||||
| 1.0-4P WT Series | Contact Pin (Housing) | Phosphor Bronze (0.15mm thickness) | Tin Plating (3-4m) | Refer to Drawing | |||||
| 1.0-4P WT Series | Contact Pin (Open Wafer) | Phosphor Bronze (0.30mm thickness) | Tin Plating (3-4m) | Refer to Drawing | |||||
| 1.0-4P WT Series | Contact Pin (Lips Wafer) | Phosphor Bronze (0.30mm thickness) | Gold Plating (3-4m) | Refer to Drawing | |||||
| 1.0-4P WT Series | Contact Pin (Solder tabs) | Phosphor Bronze (0.25mm thickness) | Tin Plating (3-4m) | Refer to Drawing | |||||
| 1.0-4P WT Series | Housing (Nylon66 UL94V-0) | Nylon66 UL94V-0 | N/A | Refer to Drawing | |||||
| 1.0-4P WT Series | Housing (Nylon46 UL94V-0) | Nylon46 UL94V-0 | N/A | Refer to Drawing | |||||
| 1.0-4P WT Series | Housing (PBT UL94V-0) | PBT UL94V-0 | N/A | Refer to Drawing | |||||
| PCB Layout Dimensions | N/A | N/A | A±0.1, B±0.1, C±0.1 | ||||||
| Use Condition | |||||||||
| Ambient Temperature Range | N/A | N/A | -25+85 | ||||||
| Applicable PC board thickness | N/A | N/A | 1.2~1.6mm | ||||||
| Mechanical Performance | |||||||||
| Pin Retention Force | N/A | N/A | ≥10N per pin | ||||||
| Terminal Retention Force | N/A | N/A | ≥10N per pin | ||||||
| Plug-in Force | N/A | N/A | ≤3N per pin | ||||||
| Plug-out Force | N/A | N/A | ≥0.5N per pin | ||||||
| Endurance Characteristics | |||||||||
| Solderability | N/A | N/A | Time:2.5±0.5S, Temp:250±5, Area:≥95% | ||||||
| Resistance to Soldering Heat | N/A | N/A | Time:5±1S, Temp:250±5 | ||||||
| Heat Test | N/A | N/A | Time:96h, Temp:+85±3 | ≤20 mΩ | |||||
| Cold Test | N/A | N/A | Time:48h, Temp:-25±3 | ≤20 mΩ | |||||
| Temperature Cycling | N/A | N/A | Low: -25±3, High: 85±3, 5 cycles | ≤20 mΩ | |||||
| Humidity Test | N/A | N/A | Temp:60±2, RH:90%-96%, Time:96h | ≤20 mΩ | ≥100MΩ | ||||
| Salt Spray Test | N/A | N/A | Conc:5±1%, Temp:35±2, Time:16±2h | ≤20 mΩ |
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