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hanxia HX NJ2.54-2x10P WZ-CE

hanxia HX NJ2.54-2x10P WZ-CE
Manufacturer:hanxia
Model Number:HX NJ2.54-2x10P WZ-CE
Minimum Order Quantity:1000
Standard Packaging:Through Hole,Right Angle,P=2.54mm
Delivery Time:4-5 weeks
Product Details
Row Spacing: 2.54mm
Operating Temperature: -40℃~+105℃
Color: Black
Current Rating: 3A
Contact Plating: Gold
Contact Material: Phosphor Bronze
Number Of Positions Or Pins: 2x10P
Number Of PINs Per Row: 10
Number Of Rows: 2
Pitch: 2.54mm
Connector Type: IDC Header
Mounting Type: Right Angle
Product Description
Detailed Specifications & Features

Product Overview

This specification covers the production and inspection of Connectors.

Use Condition:

  • Ambient Temperature Range: -40C to +105C (Wire: -40C to +105C)
  • Applicable Wire Sizes: AWG #22 to #28
  • Applicable PC Board Thickness: 1.2 mm to 1.6 mm

Appearance and Dimension:

  • Appearance: Product surface without defects, dirt, cracks, and mechanical damage. Contacts without rust, plating not oxidized and not peeled.
  • Dimension: According to drawings.
  • Exchangable: Exchangable with same specification products.
Material: Terminal Contact: Phosphor bronze
Housing: Plastic: Nylon66 UL94V-0, Color: White
Contact: Phosphor bronze, Tin Plating: 3~4 m
Housing: Plastic: Nylon46 UL94V-0, Color: Beige
Contact: Phosphor bronze, Gold Plating: 3~4 m, RoHS Compliant
Housing: Plastic: PBT UL94V-0, Color: White
Contact: Phosphor bronze, Tin Plating: 3~4 m
Solder tabs: Phosphor bronze
Wafer: Nylon46 UL94V-0, Color: Beige
No. Item Requirement
5.1 Voltage Rated 250V AC/DC
5.2 Current Rated 3A AC/DC
5.3 Contact Resistance <0.02
5.4 Insulation Resistance 1000 M
5.5 Dielectric Strength 21000V AC/minute
6.1 Male contact Retention force 10N per pin
6.2 Female contact Retention force 10N per pin
6.3 Plug-in force <3N per pin
6.4 Plug-out force 0.5N per pin
7 Soldering resistance Time: 2.50.5s, Temperature: 2605C, Area of Soldering: 95%
P/N Type Material Finish Thickness (m) Wire Size (mm)
Terminal Contact Phosphor bronze Tin Plating 3~4 0.15
Wafer Tin Plating 3~4 0.30
Contact Phosphor bronze Tin Plating 3~4 0.30
Lips Wafer Phosphor bronze Gold Plating 3~4 0.30
Wafer Tin Plating 3~4 0.30
Solder tabs Phosphor bronze Tin Plating 3~4 0.25
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