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hanxia HX PM1.0-1x3P ZC
hanxia HX PM1.0-1x3P ZC
Manufacturer:hanxia
Model Number:HX PM1.0-1x3P ZC
Minimum Order Quantity:2000
Standard Packaging:Through Hole,P=1mm
Delivery Time:4-6 weeks
Product Details
Pitch:
1mm
Voltage Rating (Max):
500V
Number Of Pins:
3P
PIN Length:
2mm
Current Rating:
750mA
Number Of Rows:
1
Contact Plating:
Gold
Contact Material:
Phosphor Bronze
Holes Structure:
1x3P
Operating Temperature:
-40℃~+105℃
Holes Direction:
Top
Circular Hole / Square Hole:
Square Hole
Mounting Type:
Through Hole
Product Description
Detailed Specifications & Features
Product Overview
This specification covers the production and inspection of Connectors. Designed for use under specific environmental conditions.
Usage Conditions:
- Ambient Temperature Range: -40C to +105C
- Applicable Wire Sizes: AWG #28 to #32
- Applicable PC Board Thickness: 1.2 mm to 1.6 mm
Appearance:
Product surface without defects, dirt, cracks, or mechanical damage. Contacts without rust, plating not oxidized and not peeled. Dimensions according to drawings.
Exchangeability:
Exchangeable with same specification products.
BrandNot Specified
OriginNot Specified
| Part Type | Material | Finish | Thickness | RoHS Compliant |
|---|---|---|---|---|
| Terminal Contact | Phosphor bronze | Tin Plating | 3~4 m | |
| Housing | Nylon66 UL94V-0 | |||
| Opening Wafer | Plastic | |||
| Contact | Phosphor bronze | Tin Plating | 3~4 m | |
| Lips Wafer | Plastic | |||
| Contact | Phosphor bronze | Gold Plating | 3~4 m | Yes |
| Housing | PBT UL94V-0 | |||
| Contact | Phosphor bronze | Tin Plating | 3~4 m | |
| Solder Tabs | Phosphor bronze | Tin Plating | 3~4 m | |
| Tiepian Wafer | Plastic | |||
| Wafer | Nylon46 UL94V-0 |
| Specification | Value | Unit |
|---|---|---|
| Ambient Temperature Range | -40 | C |
| Wire Range | -40 to +105 | C |
| Applicable Wire Sizes | 28 to 32 | AWG |
| Applicable PC board thickness | 1.2 to 1.6 | mm |
| Contact Plating Thickness (Tin) | 3 to 4 | m |
| Contact Plating Thickness (Gold) | 3 to 4 | m |
| Wafer Thickness (Opening) | 0.30 | mm |
| Wafer Thickness (Lips) | 0.30 | mm |
| Wafer Thickness (Solder Tabs) | 0.25 | mm |
| Item | Specification | Value |
|---|---|---|
| Packaging | Inner Packing | Plastic bag for plastic parts, panel mounting attach material packing for inner terminals. Marked with product name, specification model, quantity, date of production. |
| Packaging | Exterior Packing | Carton, with packing list. Marked with product name, specification model, quantity, date of dispatch. Product must not rock in the box. |
| Transportation | Conditions | Allow for any way transportation. Protect from moisture and mechanical injury. |
| Storage | Temperature | -10C to +40C |
| Storage | Relative Humidity | <80% |
| Storage | Environment | Store in a warehouse free from acidic, alkaline air, and other corrosive gases. |
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