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BXCONN WF-1F125B10P
BXCONN WF-1F125B10P
Manufacturer:BXCONN
Model Number:WF-1F125B10P
Minimum Order Quantity:1000
Standard Packaging:SMD,P=1.25mm,Surface Mount,Right Angle
Delivery Time:7-15 working days
Product Details
Y-Width Of Bottom Edge On Board:
4.1mm
Flame Retardant Rating:
UL94V-0
Reference Series:
GH
Pins Structure:
1x10P
Contact Plating:
Tin
Contact Material:
Brass;LCP
Pitch:
1.25mm
Voltage Rating (Max):
50V
Number Of PINs Per Row:
10
Number Of Rows:
1
Z-Height Of The Board:
4.35mm
Operating Temperature:
-25℃~+85℃
Mounting Type:
Surface Mount, Right Angle
Product Description
Detailed Specifications & Features
Packaging Specifications
This product utilizes professional industrial packaging solutions to ensure component safety during transit and storage.
Packaging Material
PE Waterproof Bag, Bubble Bag, Desiccant
Quantity per Reel
1 PCS per reel
Feature
Vacuum suction position available
| Pin Configuration | Packaging Components |
|---|---|
| 2~6 Pin | Desiccant, PE Waterproof Bag, Bubble Bag |
| 7 Pin | Desiccant, PE Waterproof Bag, Bubble Bag |
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