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HanElectricity HY-6AWT
HanElectricity HY-6AWT
Manufacturer:HanElectricity
Model Number:HY-6AWT
Minimum Order Quantity:800
Standard Packaging:SMD,P=2mm,Surface Mount,Right Angle
Delivery Time:7-15 working days
Product Details
Pins Structure:
1x6P
Contact Plating:
Tin
Contact Material:
Phosphor Bronze;PA66
Pitch:
2mm
Voltage Rating (Max):
100V
Number Of PINs Per Row:
6
Number Of Rows:
1
Mounting Type:
Surface Mount, Right Angle
Operating Temperature:
-25℃~+85℃
Z-Height Of The Board:
5.1mm
Product Description
Detailed Specifications & Features
Product Specifications for ZH Series Connector Strip
This specification document outlines the product performance, test methods, and inspection requirements for the ZH series connector strip.
Applicable Standards:
- GB/T2421: Testing method for Environmental of Electrical Connectors Class 1: General Principles
- GB/T2423: Testing method for Environmental of Electrical Connectors
- GB/T2424: Testing method for Environmental of Electrical Connectors
- GB/T5095: Testing Procedure/method for components of electric equipment
Customer
HANYONES ELECTRONICS CO.,LTD
Project
2.0MM
Part No.
HY
Brand
HANYONES
Origin
Dongguan
| Item | Type | Material | Finish | Explanation |
|---|---|---|---|---|
| Terminal | Contact | Phosphor bronze | Tin Plating: 3~5m | Thickness: 0.20mm |
| Housing | Plastic Shell | Nylon66 UL94V-0 | Color: White | |
| Housing | Plastic Shell | PBT UL94V-0 | Color: White | |
| Wafer | Straight Pin | Brass | Tin Plating: 2.5~5m | Thickness: 0.50mm |
| Wafer | Plastic Shell | PBT UL94V-0 | Color: White | |
| Wafer | Right Angle Pin | Brass | Tin Plating: 2.5~5m | Thickness: 0.50mm |
| Wafer | Plastic Shell | PBT UL94V-0 | Color: White | |
| Wafer | Position Right Angle Pin | Brass | Tin Plating: 2.5~5m | Thickness: 0.50mm |
| Wafer | Plastic Shell | PA46 UL94V-0 | Color: Beige | |
| Wafer | Horizontal Mount Pin | Brass | Tin Plating: 2.5~5m | Thickness: 0.50mm |
| Wafer | Solder Tab | Phosphor bronze | Tin Plating: 3~5m | Thickness: 0.25mm |
| Wafer | Plastic Shell | PA6T UL94V-0 | Color: Beige | |
| Wafer | Vertical Mount Pin | Brass | Tin Plating: 2.5~5m | Thickness: 0.50mm |
| Wafer | Solder Tab | Phosphor bronze | Tin Plating: 3~5m | Thickness: 0.25mm |
| No. | Item | Test Mode | Requirement |
|---|---|---|---|
| 6.1 | Current Rated | 1A AC DC | |
| 6.2 | Voltage Rated | 100V AC DC | |
| 6.3 | Contact Resistance | Mate connector, max test voltage 20mV, max test current 100mA | Initial value 20m (excluding wire resistance) |
| 6.4 | Withstand Voltage | Mate connectors, 500V AC (rms) for 1 minute between adjacent terminals to ground, leakage current 0.5mA | No breakdown or flashover |
| 6.5 | Insulation Resistance | Between adjacent contacts, 500V DC for 1 minute | 500 M |
| 7.1 | Terminal crimping wire strength | AWG#26 wire, pullout force at 253mm/min | 20N |
| AWG#28 wire, pullout force at 253mm/min | 13N | ||
| AWG#30 wire, pullout force at 253mm/min | 8N | ||
| AWG#32 wire, pullout force at 253mm/min | 6N | ||
| 7.2 | Fixed terminals and hole seat | Terminal pulled from hole seat at 253mm/min along wire direction | Per contact: 10N |
| 7.3 | Single contact insertion force | Housing with terminal matched with wafer, insertion force at 253mm/min | 6N |
| 7.4 | Single contact withdrawal force | Housing with terminal matched with wafer, withdrawal force at 253mm/min | 0.6N |
| 7.5 | Pin Retention force | Force applied to pin end at 253mm/min until pin exits seat | Per contact: 10N |
| 7.6 | Durability | Mate connectors up to 30 cycles (max 10 cycles/min) before environmental test | Contact Resistance 30 m |
| 7.7 | Vibration | Connector combination on PCB, vibration test (10-55-10 Hz/min, 1.5mm p-p amplitude, 2 hours per axis: Y, X, Z) | Appearance: No damage, Contact Resistance 30 m, Current Discontinuity: 1sec Max |
| 8.1 | Thermal Aging | Mate connector in oven at 852 for 96 hours continuously | Appearance: No damage, Contact Resistance 30 m |
| 8.2 | Temperature Rise | Mate connector at maximum rated current | 30 Max |
| 8.3 | Humidity | Mate connector at 402, 90-95%RH for 96 hours continuously | Appearance: No damage, Contact Resistance 30m, Insulation Resistance 250M, No breakdown or flashover |
| 8.4 | Temperature Cycling | Connectors tested with 5 cycles: (-553, 30min -> Room temp. 10-15min) and (853, 30min -> Room temp. 10-15min) | Same as paragraph 8.3 |
| 8.5 | Salt Spray | Connectors tested with salt spray (353, 51% solution) | Stamping after tin plated: 8 hours; Stamping before tin plated: 24 hours. Appearance: No damage, Contact Resistance 30 m |
| 8.6 | Solder ability | Immersion in solder at 2455 for 30.5S | Area of Soldering: 90% |
| 8.7 | Resistance to soldering heat | Manual soldering: 30.5S at 3505; Wave soldering: 50.5S at 2305; Reflow soldering: 20S Max at 2555 | Appearance: No damage |
| No. | Item | Details |
|---|---|---|
| 9.1 | SMT Lead-free Process Temperature Curve | Refer to temperature curve diagram (not provided in text) |
| Section | Description |
|---|---|
| 10.1 Packaging | Terminal: disc loading material packaging. Plastic shell: plastic bags. Wafer: disc loading, bag loading. Includes certificate with product name, specs, quantity, production date. Exterior: carton with packing list. Product must not shift in box. |
| 10.2 Transportation | Any vehicle. Avoid direct rain/sun, collision, extrusion. Transport temperature: -20~+50. |
| 10.3 Storage | (Details not provided in text) |
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