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HanElectricity HY-6AWT

HanElectricity HY-6AWT
Manufacturer:HanElectricity
Model Number:HY-6AWT
Minimum Order Quantity:800
Standard Packaging:SMD,P=2mm,Surface Mount,Right Angle
Delivery Time:7-15 working days
Product Details
Pins Structure: 1x6P
Contact Plating: Tin
Contact Material: Phosphor Bronze;PA66
Pitch: 2mm
Voltage Rating (Max): 100V
Number Of PINs Per Row: 6
Number Of Rows: 1
Mounting Type: Surface Mount, Right Angle
Operating Temperature: -25℃~+85℃
Z-Height Of The Board: 5.1mm
Product Description
Detailed Specifications & Features

Product Specifications for ZH Series Connector Strip

This specification document outlines the product performance, test methods, and inspection requirements for the ZH series connector strip.

Applicable Standards:

  • GB/T2421: Testing method for Environmental of Electrical Connectors Class 1: General Principles
  • GB/T2423: Testing method for Environmental of Electrical Connectors
  • GB/T2424: Testing method for Environmental of Electrical Connectors
  • GB/T5095: Testing Procedure/method for components of electric equipment

Customer

HANYONES ELECTRONICS CO.,LTD

Project

2.0MM

Part No.

HY

Brand

HANYONES

Origin

Dongguan

Item Type Material Finish Explanation
Terminal Contact Phosphor bronze Tin Plating: 3~5m Thickness: 0.20mm
Housing Plastic Shell Nylon66 UL94V-0 Color: White
Housing Plastic Shell PBT UL94V-0 Color: White
Wafer Straight Pin Brass Tin Plating: 2.5~5m Thickness: 0.50mm
Wafer Plastic Shell PBT UL94V-0 Color: White
Wafer Right Angle Pin Brass Tin Plating: 2.5~5m Thickness: 0.50mm
Wafer Plastic Shell PBT UL94V-0 Color: White
Wafer Position Right Angle Pin Brass Tin Plating: 2.5~5m Thickness: 0.50mm
Wafer Plastic Shell PA46 UL94V-0 Color: Beige
Wafer Horizontal Mount Pin Brass Tin Plating: 2.5~5m Thickness: 0.50mm
Wafer Solder Tab Phosphor bronze Tin Plating: 3~5m Thickness: 0.25mm
Wafer Plastic Shell PA6T UL94V-0 Color: Beige
Wafer Vertical Mount Pin Brass Tin Plating: 2.5~5m Thickness: 0.50mm
Wafer Solder Tab Phosphor bronze Tin Plating: 3~5m Thickness: 0.25mm
No. Item Test Mode Requirement
6.1 Current Rated 1A AC DC
6.2 Voltage Rated 100V AC DC
6.3 Contact Resistance Mate connector, max test voltage 20mV, max test current 100mA Initial value 20m (excluding wire resistance)
6.4 Withstand Voltage Mate connectors, 500V AC (rms) for 1 minute between adjacent terminals to ground, leakage current 0.5mA No breakdown or flashover
6.5 Insulation Resistance Between adjacent contacts, 500V DC for 1 minute 500 M
7.1 Terminal crimping wire strength AWG#26 wire, pullout force at 253mm/min 20N
AWG#28 wire, pullout force at 253mm/min 13N
AWG#30 wire, pullout force at 253mm/min 8N
AWG#32 wire, pullout force at 253mm/min 6N
7.2 Fixed terminals and hole seat Terminal pulled from hole seat at 253mm/min along wire direction Per contact: 10N
7.3 Single contact insertion force Housing with terminal matched with wafer, insertion force at 253mm/min 6N
7.4 Single contact withdrawal force Housing with terminal matched with wafer, withdrawal force at 253mm/min 0.6N
7.5 Pin Retention force Force applied to pin end at 253mm/min until pin exits seat Per contact: 10N
7.6 Durability Mate connectors up to 30 cycles (max 10 cycles/min) before environmental test Contact Resistance 30 m
7.7 Vibration Connector combination on PCB, vibration test (10-55-10 Hz/min, 1.5mm p-p amplitude, 2 hours per axis: Y, X, Z) Appearance: No damage, Contact Resistance 30 m, Current Discontinuity: 1sec Max
8.1 Thermal Aging Mate connector in oven at 852 for 96 hours continuously Appearance: No damage, Contact Resistance 30 m
8.2 Temperature Rise Mate connector at maximum rated current 30 Max
8.3 Humidity Mate connector at 402, 90-95%RH for 96 hours continuously Appearance: No damage, Contact Resistance 30m, Insulation Resistance 250M, No breakdown or flashover
8.4 Temperature Cycling Connectors tested with 5 cycles: (-553, 30min -> Room temp. 10-15min) and (853, 30min -> Room temp. 10-15min) Same as paragraph 8.3
8.5 Salt Spray Connectors tested with salt spray (353, 51% solution) Stamping after tin plated: 8 hours; Stamping before tin plated: 24 hours. Appearance: No damage, Contact Resistance 30 m
8.6 Solder ability Immersion in solder at 2455 for 30.5S Area of Soldering: 90%
8.7 Resistance to soldering heat Manual soldering: 30.5S at 3505; Wave soldering: 50.5S at 2305; Reflow soldering: 20S Max at 2555 Appearance: No damage
No. Item Details
9.1 SMT Lead-free Process Temperature Curve Refer to temperature curve diagram (not provided in text)
Section Description
10.1 Packaging Terminal: disc loading material packaging. Plastic shell: plastic bags. Wafer: disc loading, bag loading. Includes certificate with product name, specs, quantity, production date. Exterior: carton with packing list. Product must not shift in box.
10.2 Transportation Any vehicle. Avoid direct rain/sun, collision, extrusion. Transport temperature: -20~+50.
10.3 Storage (Details not provided in text)
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