<
>
BXCONN WF-1F100A13P
BXCONN WF-1F100A13P
Manufacturer:BXCONN
Model Number:WF-1F100A13P
Minimum Order Quantity:2000
Standard Packaging:SMD,P=1mm,Surface Mount,Right Angle
Delivery Time:7-15 working days
Product Details
Y-Width Of Bottom Edge On Board:
2.9mm
Flame Retardant Rating:
UL94V-0
Pins Structure:
1x13P
Reference Series:
SH
Contact Plating:
Tin
Pitch:
1mm
Contact Material:
Brass;LCP
Voltage Rating (Max):
50V
Number Of PINs Per Row:
13
Number Of Rows:
1
Z-Height Of The Board:
3.65mm
Operating Temperature:
-25℃~+85℃
Mounting Type:
Surface Mount, Right Angle
Product Description
Detailed Specifications & Features
Packaging Specifications
This product utilizes a multi-layer protective packaging system designed to ensure component integrity during storage and transit.
Packaging Components
Desiccant, PE Waterproof Bag, Bubble Bag
Unit Quantity
1 PCS per tray
| Packaging Item | Specification |
|---|---|
| Desiccant | Standard moisture protection |
| Inner Protection | PE Waterproof Bag |
| Outer Protection | Bubble Bag |
| Unit Capacity | 1 PCS per tray |
Message for quick reply
Related Products