TE Connectivity 2309407-2
Product Overview
Product Type: SO DIMM Sockets
DRAM Type: DDR4
Application: Memory Card, Circuit Application Power
Brand
TE Connectivity
Part Number
2309407-2
Module Orientation
Right Angle
Housing Material
High Temperature Thermoplastic
Housing Color
Black
Latch Material
High Temperature Thermoplastic
Module Key Type
Locking
Ejector Type
Locking
Ejector Location
Both Ends
Retention Post Location
Both Ends
Contact Base Material
Copper Alloy
PCB Contact Termination Area Plating Material
Gold Flash
Contact Mating Area Plating Material
Gold
Packaging Method
Tape & Reel
UL Flammability Rating
UL 94V-0
EU RoHS Compliance
Compliant
EU ELV Compliance
Compliant
China RoHS 2 Compliance
No Restricted Materials Above Threshold
REACH Compliance
Does not contain REACH SVHC
Halogen Content
Low Halogen - Br, Cl, F, I < 900 ppm per homogenous material. Also BFR/CFR/PVC Free
Solder Process Capability
Reflow solder capable to 260C
| Part Number | DRAM Type | Stack Height | Module Orientation | Number of Positions | Centerline (Pitch) | Row-to-Row Spacing | Contact Current Rating (Max) | Contact Mating Area Plating Material Thickness | Connector System | Connector Mounting Type | PCB Mount Retention Type | PCB Mount Retention | Keying Alignment Type | Insertion Style | Termination Method to PCB | Operating Temperature Range | Packaging Quantity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2309407-2 | DDR4 | 4 mm [.157 in] | Right Angle | 260 | .5 mm [.02 in] | 8.2 mm [.322 in] | S5A | 127 m [5 mil] | Cable-to-Board | Board Mount | Solder Peg | With | Standard | Cam-In | Surface Mount | -55 - 85 C [-67 185 F] | 900 |
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