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HRS DF11-28DEP-2C

HRS DF11-28DEP-2C
Manufacturer:HRS
Model Number:DF11-28DEP-2C
Minimum Order Quantity:1
Standard Packaging:P=2mm
Delivery Time:1 working day
Product Details
Pitch: 2mm
Flame Retardant Rating: UL94V-0
Number Of Rows: 2
Colour: Black
With Wings: With Fins
Operating Temperature: -35℃~+85℃
Number Of PINs Per Row: 24
Number Of Positions Or Pins: 2x12P
With Locker: Non-Latching
Product Description
Detailed Specifications & Features

Product Overview

The HIROSE DF11 Series is a 2.0mm pitch, double-row connector designed for space-saving on PCBs. It offers double the signal density of conventional single-row connectors within a 5mm width. Available in various connection methods including crimping, cable-to-board, in-line, and board-to-board configurations, with selectable gold or tin plating and SMT compatibility. It supports a wide applicable wire range of 22 to 30 AWG and is suitable for business equipment such as copy machines and printers.

Product Attributes

  • Brand: HIROSE
  • Series: DF11
  • Pitch: 2.0mm
  • Certifications: UL/CSA Compliant
  • Contact Material: Phosphor Copper, Brass
  • Insulator Material: Polyamide
  • Insulator Color: Black, Beige
  • Plating Options: Tin Plated, Gold Plated

Technical Specifications

SpecificationDetails
Rated Current2A/pin (22-26 AWG), 1A/pin (28 AWG), 0.5A/pin (30 AWG)
Rated Voltage250V AC/DC (General), 30V AC/DC (UL, CSA)
Operating Temperature Range-30 to +85
Storage Temperature Range-10 to +60
Insulation Resistance1000M Min. (500V DC)
Withstanding Voltage650V AC for 1 min.
Contact Resistance30m Max. (100mA)
Single Insertion/Extraction Force0.3N (30gf) Min. to 4.4N (450gf) Max.
VibrationNo electrical discontinuity of 1 s or more (10 to 55Hz, 0.75mm amplitude, 2 hours/direction)
Humidity (Steady State)Contact Resistance: 30m Max., Insulation Resistance: 500M Min. (96 hours at 402, 90-95% RH)
Temperature CycleContact Resistance: 30m Max., Insulation Resistance: 1000M Min. (5 cycles: -5585)
Mating DurabilityTin Plated: 30 cycles, Gold Plated: 50 cycles
Resistance to Soldering HeatThrough Hole Flow: 260/10s, Manual: 300/2s, SMT Reflow: Recommended profile, Manual: 300/3s
Applicable Wire Range22 to 30 AWG
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