TE Connectivity 5-103168-4
Product Overview
Product Name: PCB Mount Header, Vertical, Board-to-Board, 12 Position, 2.54 mm [.1 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, AMPMODU Headers
Description: This product is a PCB Mount Header designed for vertical, board-to-board connections. It features a 12-position configuration with a 2.54 mm [.1 in] centerline, is fully shrouded, and has gold plating. The termination method is through-hole solder.
| Specification | Value |
|---|---|
| Centerline (Pitch) | 2.54 mm [.1 in] |
| Housing Material | Thermoplastic |
| Row-to-Row Spacing | 2.54 mm [.1 in] |
| PCB Thickness (Recommended) | 1.4 mm [.055 in] |
| Operating Temperature Range | -65 - 105 C [-85 - 221 F] |
| Circuit Application | Signal |
| Contact Base Material | Phosphor Bronze |
| Contact Underplating Material | Nickel |
| Contact Termination Area Plating Material | Tin |
| Contact Termination Area Plating Material Thickness | 2.54 - 5.08 m [100 - 200 in] |
| Contact Mating Area Plating Material | Gold |
| Contact Mating Area Plating Material Thickness | 762 m [30 in] |
| Contact Type | Pin |
| Contact Current Rating (Max) | 3 A |
| Termination Method to Printed Circuit Board | Through Hole - Solder |
| Square Termination Post & Tail Dimension | 0.64 mm [.025 in] |
| Termination Post & Tail Length | 3.18 mm [.125 in] |
| Mating Retention Type | Detent Window |
| Mating Alignment Type | Polarization |
| Connector Mounting Type | Board Mount |
| Housing Temperature Rating | Standard |