JST XAP-03V-1
Product Overview
The JST XA Connector High Box Type is a disconnectable crimp-style connector designed for 2.5mm pitch applications, specifically for use with resin-coated ("potted") PC boards. It offers high mounting height and thickness, ensuring robust connections.
Product Attributes
- Brand: JST
- Material (Header): Glass-filled PA 66, UL94V-0, natural (ivory)
- Material (Housing): PA 66, UL94V-0, natural (white)
- Material (Contact): Phosphor bronze, tin-plated (reflow treatment)
- Material (Post/Wafer): Copper alloy, copper-undercoated, tin-plated (reflow treatment) / Glass-filled PA 66, UL94V-0, natural (ivory)
- Certifications: UL Recognized E60389, CSA Certified LR20812
- Compliance: RoHS
Technical Specifications
| Product Type | Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Q'ty / bag | Q'ty / reel | Q'ty / box | Material |
|---|---|---|---|---|---|---|---|---|
| Header (High Box Type) | XMS-XXV | 2-15 | 2.5 to 35.0 | - | 1,000 | - | - | Glass-filled PA 66, UL94V-0, natural (ivory) |
| Housing (Standard Type) | XAP-XXV-1 | 2-15 | 2.5 to 35.0 | 7.3 to 39.8 | 1,000 | - | - | PA 66, UL94V-0, natural (white) |
| Housing (Retainer Mountable Type) | XARP-XXV | 2-15 | 2.5 to 35.0 | 9.8 to 42.3 | 1,000 (2-13), 500 (14-15) | - | - | PA 66, UL94V-0, natural (white) |
| Contact | SXA-001T-P0.6 | - | - | - | 8,000 | - | - | Phosphor bronze, tin-plated (reflow treatment) |
| Shrouded Header (Without a boss) | BHXXB-XASK-BN | 2-15 | 2.5 to 35.0 | 7.5 to 40.0 | - | - | 400 (2-3), 300 (4-5), 200 (6-10), 100 (11-15) | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) |
| Shrouded Header (With a boss) | BHXXB-XASK | 2-15 | 2.5 to 35.0 | 10.0 to 42.5 | - | - | 400 (2-3), 300 (4-5), 200 (6-10), 100 (11-15) | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) |
| Shrouded Header on Radial Tape (Without a boss) | BHXXB-XASS-BN-T | 2-8 | 2.5 to 17.5 | 7.5 to 22.5 | - | - | 1,000 (2-3), 500 (4-8) | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) |
| Shrouded Header on Radial Tape (With a boss) | BHXXB-XASS-T | 2-8 | 2.5 to 17.5 | 10.0 to 25.0 | - | - | 1,000 (2-3), 500 (4-8) | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) |
General Specifications
| Specification | Value |
|---|---|
| Pitch | 2.5mm |
| Current Rating | 3A AC, DC (AWG #22) |
| Voltage Rating | 250V AC, DC |
| Temperature Range | -25C to +85C |
| Contact Resistance | Initial: 10mmax. / After environmental testing: 20mmax. |
| Insulation Resistance | 1,000M min. |
| Withstanding Voltage | 1,000V AC/minute |
| Applicable Wire | AWG #28 to #22 |
| Applicable PC Board Thickness | 1.6mm |
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