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HRS BM24-24DP/2-0.35V(51)
HRS BM24-24DP/2-0.35V(51)
Manufacturer:HRS
Model Number:BM24-24DP/2-0.35V(51)
Minimum Order Quantity:10
Standard Packaging:SMD,P=0.35mm
Product Details
Pitch:
0.35mm
Number Of Rows:
2
Number Of Pins:
26P
Operating Temperature:
-40℃~+85℃
Contact Plating:
Gold
Current Rating:
5A
Mounting Type:
Surface Mount,Vertical
Product Description
Detailed Specifications & Features
BM24 Series: Hybrid Power/Signal Connectors
The BM24 Series offers 0.35mm pitch, 0.8mm height hybrid power and signal connectors designed for board-to-board and FPC-to-board applications. These connectors provide a compact solution for integrating power and signal transmission.
Brand
HIROSE ELECTRIC CO., LTD.
Series Name
BM
Series Number
24
Pitch
0.35mm
Height
0.8mm
Insulator Material
LCP (UL94V-0)
Signal Contact Material
Phosphor bronze
Power Contact Material
Copper alloy
Plating
Gold plated
Connector Type
Receptacle (DS) / Header (DP)
Termination Type
Straight SMT (V)
Packaging
Embossed tape (10,000 pcs/reel)
| Item | Specifications | Conditions | Value |
|---|---|---|---|
| Insulation resistance | 100M min. | Measured at 100V DC | |
| Withstanding voltage | No flashover or dielectric breakdown | 150V AC for one minute | |
| Contact resistance (Signal) | 100m max. | Measured at 20mV AC, 1kHz, and 1mA | |
| Contact resistance (Power) | 15m max. | Measured at 20mV AC, 1kHz, and 1mA | |
| Vibration | Insulation resistance: 50M min. Contact resistance: Signal 100m max., Power 15m max. No electrical discontinuity for more than 1s. | Frequency: 10 to 55 Hz ; half amplitude: 0.75mm, in 3 axis directions for 2 hours | |
| Humidity | Contact resistance: Signal 100m max., Power 15m max. | 96 hours at 40C and 90 to 95% humidity | |
| Temperature cycle | Contact resistance: Signal 100m max., Power 15m max. Insulation resistance: 100M min. | (-55C for 30 min 5 to 35C for 10 min 85C for 30 min 5 to 35C for 10 min) in 5 cycles | |
| Durability | Contact resistance: Signal 100m max., Power 15m max. | 10 mating cycles | |
| Solder heat resistance | No dissolution or melting of resin affecting performance. | Reflow: with recommended profile; Hand soldering: 350C max. for 3 seconds |
| Rating | Value | Unit | Condition |
|---|---|---|---|
| Rated current (Power contact) | 5 | A | |
| Rated current (Signal contact) | 0.25 | A | (Note 1) |
| Rated voltage | 30 | V AC/DC | |
| Operating temperature range | -40 to 85 | C | (Note 2) |
| Storage temperature range | -10 to 60 | C | (Note 3) |
| Operating humidity range | 20 to 80 | % | |
| Storage humidity range | -15 to 70 | % | (Note 3) |
Notes
- Note 1: The total current capacity for connectors with 40 or more signal contacts is 10A for all contacts.
- Note 2: Includes temperature rise caused by current flow.
- Note 3: Storage refers to long-term storage of unused items before mounting. Operating temperature/humidity range applies to temporary storage after mounting and during transportation.
Product Number Structure Example
BM24 - % DS / 2 - 035 V (51)
- @ Series Name: BM
- @ Series No.: 24
- @ Connector type: DS (Receptacle), DP (Header)
- @ Number of Power Contacts: 2
- @ Number of Signal Contacts: 10, 20, 24, 30, 40
- @ Contact Pitch: 0.35mm
- @ Termination type: V (Straight SMT)
- @ Gold plated specification and packaging status: (51) Gold plate thickness 0.05m, Embossed tape packaging (10,000 pcs/reel)
Precautions
- Recommended solder temperature profile: Peak 250C, Heat section 220C min. (60 sec), Preheat section 150-180C (90-120 sec), Max 2 reflow cycles.
- Recommended manual soldering: 340 10C for within 3 seconds.
- Recommended stencil thickness: 0.1mm. Aperture ratio: 80% (DS), 70% (DP).
- Board warpage: Max 0.02mm at the center relative to ends.
- Cleaning is not recommended. If performed, evaluate performance first.
- Care when mating/unmating to avoid contact damage.
- Avoid supporting PCB solely with connectors.
- Do not apply excessive prying force during mating/unmating.
- Avoid flux wicking during hand soldering.
- Slight color differences are possible due to lot variability but do not affect performance.
- Secure mated connectors to the board with housings and cushioning materials to prevent disengagement from drops or impacts.
- Do not use in non-recommended conditions (rated current, voltage, environment).
- Consult Hirose for use under conditions other than specified.
- When mating, position correctly and apply force without horizontal movement.
- When unmating, pull in a straight line. If difficult, pull obliquely with adequate FPC support.
- Avoid unmating by a corner.
- Ensure FPC has a stiffener (e.g., glass epoxy min. 0.3mm, stainless steel min. 0.2mm).
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