HCTL HC-2510-2A
Product Overview
Scope: This specification applies to the 2510 series connector strip, covering product performance, test methods, and inspection requirements.
Use Conditions: Ambient temperature range: -25+85. Applicable wire sizes: AWG#24#30. Applicable PC board thickness: 1.6mm.
Appearance: Product surface free from defects, dirt, cracks, and mechanical damage. Contacts free from rust, oxidation, or plating peel-off.
Exchangeability: Products of the same specification should be interchangeable.
Brand
Origin
Model Series
Technical Specifications
| Item | Test Mode | Requirement |
|---|---|---|
| Rated Current | 4A AC/DC | |
| Rated Voltage | 250V AC/DC | |
| Contact Resistance | Mate connector, 20mV max, 100mA max | Initial value: ≤ 20mΩ (excluding wire resistance) |
| Withstand Voltage | Mate connectors, 1000V AC (rms) for 1 min, adjacent terminals to ground | No breakdown or flashover; leakage current ≤ 0.5mA |
| Insulation Resistance | Adjacent contacts, 500V DC (rms) for 1 min | ≥ 1000MΩ |
| Terminal crimping wire strength (AWG#24) | Axial pullout force at 25±3mm/min | ≥ 30N |
| Terminal crimping wire strength (AWG#26) | Axial pullout force at 25±3mm/min | ≥ 20N |
| Terminal crimping wire strength (AWG#28) | Axial pullout force at 25±3mm/min | ≥ 13N |
| Terminal crimping wire strength (AWG#30) | Axial pullout force at 25±3mm/min | ≥ 8N |
| Fixed terminals and hole seat | Pullout force at 25±3mm/min along wire direction (per contact) | ≥ 15N |
| Single contact insertion force | Housing with terminal and wafer matched, at 25±3mm/min | ≤ 6N |
| Single contact withdrawal force | Housing with terminal and wafer matched, at 25±3mm/min | ≥ 0.6N |
| Pin Retention force | Force on pin end at 25±3mm/min until exit (per contact) | ≥ 15N |
| Durability | 30 cycles (max 10 cycles/min) before environmental test | Contact Resistance: ≤ 30mΩ |
| Vibration | Welded to PCB, 10-55-10 Hz/min, 1.5mm p-p amplitude, 2 hrs per axis (X, Y, Z) | Appearance: No damage; Contact Resistance: ≤ 30mΩ; Current Discontinuity: 1µsec Max |
| Thermal Aging | 85±2 for 96 hours | Appearance: No damage; Contact Resistance: ≤ 30mΩ |
| Temperature Rise | At maximum rated current | 30 Max |
| Humidity (Constant) | 40±2, 90-95%RH for 96 hours | Appearance: No damage; Contact Resistance: ≤ 30mΩ; Insulation Resistance: ≥ 500MΩ; Withstand Voltage: No breakdown or flashover |
| Temperature Cycling | 5 cycles: -55±3 (30min) ⇔ 85±3 (30min) with 10-15min room temp transition | Same as paragraph 8.3 |
| Salt Spray | 35±3, 5±1% solution. Stamped after tin plated: 8 hrs; Stamped before tin plated: 48 hrs | Appearance: No damage; Contact Resistance: ≤ 30mΩ |
| Solderability | Solder Temp: 245±5, Immersion: 3±0.5S | Soldering Area: ≥ 90% |
| Resistance to soldering heat (Manual) | Soldering time: 3±0.5S, Soldering pot: 305±5 | Appearance: No damage |
| Resistance to soldering heat (Wave) | Soldering time: 5±0.5S, Soldering pot: 230±5 | Appearance: No damage |
Packaging, Transportation, Storage
Packaging
(1) Terminals: Reel packaging. Housing: Plastic bags. Headers: Bagged. Includes certificate with product name, spec, quantity, production date.
(2) Exterior: Carton with packing list detailing product name, spec, quantity, dispatch date.
(3) Product must not shift within the box.
Transportation
Any vehicle acceptable. Avoid moisture and mechanical damage. Transport temperature: -20~+50.
Storage
(1) Ambient temperature: -10 to +40, Relative humidity ≤ 80%. Store in a warehouse free from acidic, alkaline, or other corrosive gases.
(2) Re-qualification test required if storage exceeds 6 months.
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