JST XARP-06V
JST XA Connector, High Box Type
The JST XA Connector, High Box Type, is a disconnectable crimp-style connector designed for 2.5mm pitch applications, specifically for use with resin-coated ("potted") PC boards. It offers a high box type with a mounting height of 19.5mm and a thickness of 6.9mm, providing robust connection solutions.
Product Attributes
- Brand: JST
- Material (Header): Glass-filled PA 66, UL94V-0, natural (ivory)
- Material (Housing): PA 66, UL94V-0, natural (white)
- Material (Contact): Phosphor bronze, tin-plated (reflow treatment)
- Material (Post/Wafer - Shrouded Header): Copper alloy, copper-undercoated, tin-plated (reflow treatment) / Glass-filled PA 66, UL94V-0, natural (ivory)
- Certifications: UL Recognized E60389, CSA Certified LR20812
- RoHS Compliance: Yes
Technical Specifications
| Product Type | Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Q'ty / bag / reel / box | Material |
|---|---|---|---|---|---|---|
| Header (High box type) | XMS-02V to XMS-15V | 2 to 15 | 2.5 to 35.0 | - | 1,000 | Glass-filled PA 66, UL94V-0, natural (ivory) |
| Housing (Standard type) | XAP-02V-1 to XAP-15V-1 | 2 to 15 | 2.5 to 35.0 | 7.3 to 39.8 | 1,000 | PA 66, UL94V-0, natural (white) |
| Housing (Retainer mountable type) | XARP-02V to XARP-15V | 2 to 15 | 2.5 to 35.0 | 9.8 to 42.3 | 1,000 (2-13 circuits), 500 (14-15 circuits) | PA 66, UL94V-0, natural (white) |
| Contact | SXA-001T-P0.6 | - | - | - | 8,000 / reel | Phosphor bronze, tin-plated (reflow treatment) |
| Shrouded Header (Without a boss) | BH02B-XASK to BH15B-XASK | 2 to 15 | 2.5 to 35.0 | 7.5 to 40.0 | 400 (2-3 circuits), 300 (4-5 circuits), 200 (6-8 circuits), 150 (9-10 circuits), 100 (11-15 circuits) | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) |
| Shrouded Header (With a boss) | BH02B-XASK-BN to BH15B-XASK-BN | 2 to 15 | 2.5 to 35.0 | 10.0 to 42.5 | 400 (2-3 circuits), 300 (4-5 circuits), 200 (6-8 circuits), 150 (9-10 circuits), 100 (11-15 circuits) | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) |
| Shrouded Header on radial-tape (Without a boss) | BH02B-XASS-T to BH08B-XASS-T | 2 to 8 | 2.5 to 17.5 | 7.5 to 22.5 | 1,000 (2-3 circuits), 500 (4-8 circuits) | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) |
| Shrouded Header on radial-tape (With a boss) | BH02B-XASS-BN-T to BH08B-XASS-BN-T | 2 to 8 | 2.5 to 17.5 | 10.0 to 25.0 | 1,000 (2-3 circuits), 500 (4-8 circuits) | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) |
General Specifications
| Parameter | Specification |
|---|---|
| Pitch | 2.5mm |
| Current Rating | 3A AC, DC (AWG #22) |
| Voltage Rating | 250V AC, DC |
| Temperature Range | -25C to +85C |
| Contact Resistance | Initial: 10mmax. After environmental testing: 20mmax. |
| Insulation Resistance | 1,000M min. |
| Withstanding Voltage | 1,000V AC/minute |
| Applicable Wire | AWG #28 to #22 |
| Applicable PC Board Thickness | 1.6mm |
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