HRS DF11-6DS-2DSA(06)
DF11 Series/2.0mm Pitch, Double-Row Connector (UL/CSA Compliant)
This document provides technical specifications, handling instructions, and precautions for the DF11 Series 2.0mm pitch, double-row connectors. These connectors are UL/CSA compliant and designed for various applications requiring reliable wire-to-board connections.
Key Features & Precautions:
- Soldering Conditions (SMT): Recommended iron temperature: 290 10C, soldering time: within 2 seconds. Recommended screen thickness: 0.15 to 0.2mm. Board warpage: Max. 0.03mm allowed in the connector center area.
- Soldering Conditions (Through-hole): Recommended flow soldering: 250 5C for 10 seconds. Manual soldering: 290 10C for 2 seconds.
- Cleaning & Connection: Refer to the "Wire-to-Board Connector Use Handbook" for detailed procedures.
- Handling Precautions: Avoid inserting crimp terminals diagonally. Do not insert/remove when not mounted to the board to prevent damage. Do not hold the cable when removing the product. Avoid flux rising during hand soldering. Slight variations in mold coloration do not affect product performance.
- Documentation: Refer to specific documents like "DF11 Series Cable Assembly Procedure (ETAD-H0965-00)" and "Crimp Quality Standard (ETAD-HO773-00)" for detailed assembly and quality standards.
- Usage Guidelines: Specifications are reference values; confirm "Drawing" and "Product Specifications" sheets before ordering or use. Use appropriate cables; contact sales for non-specified cables. Assembly with non-Hirose identified jigs & tools will void assurance. Consult Hirose for specific applications (Automotive, medical, public infrastructure, aerospace/defense, etc.).
Brand
HIROSE ELECTRIC CO., LTD.
Product Series
DF11 Series
Pitch
2.0mm
Configuration
Double-Row Connector
Certifications
UL/CSA Compliant
| Item | Specification | Condition | Remarks |
|---|---|---|---|
| Wire Size (Crimping) | 22 to 26 AWG | ||
| Wire Size (IDC) | 28 AWG | ||
| Wire Size (IDC) | 30 AWG | ||
| Wire Size (IDC) | 26 AWG | ||
| Rated Current (Note 1) | 2A | (22 AWG) | |
| Rated Current (Note 1) | 1A | (24 to 28 AWG) | |
| Rated Current (Note 1) | 0.5A | (30 AWG) | |
| Rated Current (Note 1) | 1A | (26 AWG) | |
| Rated Voltage | 250V AC | (Crimping) | |
| Rated Voltage | 100V AC | (IDC) | |
| Operating Temperature Range | -30 to +85C (Note 2) | ||
| Operating Humidity Range | 40 to 80% (Note 3) | ||
| Storage Temperature Range | -10 to +60C (Note 4) | ||
| Storage Humidity Range | 40 to 70% (Note 4) | ||
| UL, CSA Safety Standard Approved Wire Size | 22 AWG | UL: E526583, CSA: LR95109 | |
| UL, CSA Safety Standard Approved Wire Size | 24 to 28 AWG | UL: E526583, CSA: LR95109 | |
| UL, CSA Safety Standard Approved Wire Size | 30 AWG | UL: E526583, CSA: LR95109 | |
| UL, CSA Safety Standard Approved Rated Current | 2A | (22 AWG) | |
| UL, CSA Safety Standard Approved Rated Current | 1A | (24 to 28 AWG) | |
| UL, CSA Safety Standard Approved Rated Current | 0.5A | (30 AWG) | |
| UL, CSA Safety Standard Approved Rated Voltage | 30V AC | ||
| Insulation Resistance | 1000M Min. | 500V DC | |
| Withstanding Voltage | 650V AC for 1 min. | No flashover or insulation breakdown. | |
| Contact Resistance | 30m Max. | 100mA | |
| Single Insertion/Extraction Force | 0.3N (30gf) Min. | Measured by the square steel pin at 0.50.002mm | |
| Single Insertion/Extraction Force | 4.4N (450gf) Max. | Measured by the square steel pin at 0.50.002mm | |
| Vibration | Frequency: 10 to 55Hz, single amplitude of 0.75mm, 2 hours in each of the 3 directions. | No electrical discontinuity of 1s or more. | |
| Humidity (Steady State) | Contact Resistance: 30m Max. Insulation Resistance: 500M Min. | 96 hours at temperature of 402C and humidity of 90 to 95% | |
| Temperature Cycle | Contact Resistance: 30m Max. Insulation Resistance: 1000M Min. | (-55C: 30 min - 5 to 35C: 10 min - 85C: 30 min - 5 to 35C: 10 min) 5 cycles | |
| Mating Durability | Contact Resistance: 30m Max. | Tin Plated: 30 cycles, Gold Plated: 50 cycles | |
| Resistance to Soldering Heat | No deformation of components affecting performance. | Flow: 260C for 10 seconds (Through Hole) | |
| Resistance to Soldering Heat | No deformation of components affecting performance. | Manual soldering: 300C for 2 seconds (Through Hole) | |
| Resistance to Soldering Heat | No deformation of components affecting performance. | Reflow: At the SMT recommended temperature profile | |
| Resistance to Soldering Heat | No deformation of components affecting performance. | Manual soldering: 300C for 3 seconds (SMT) |
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