PANASONIC AXF361500

Notes on Using Narrow pitch Connectors/High Current Connectors

About Safety Remarks

• Do not use these connectors beyond the specification sheets. Usage outside of specified rated current, dielectric strength, and environmental conditions may cause circuitry damage via abnormal heating, smoke, and fire.
• Thorough specification review is appreciated. Contact sales office for usage outside specifications. Panasonic Corporation cannot guarantee quality and reliability otherwise.
• Panasonic Corporation strives to improve quality and reliability. However, electrical components have statistical failure probabilities and varying durability. Check actual components under actual conditions before use. Continued usage in degraded condition may result in abnormal heat, smoke, or firing. Implement safety designs and periodic maintenance (redundancy, fire spread prevention, malfunction prevention) to prevent accidents.

Regarding the Design of Devices and PC Board Patterns

• When using board-to-board connectors, do not connect a pair of boards with multiple connectors. Misaligned positions may cause mating failure or product breakage.
• Mounting equipment may have positioning errors of +0.2 to 0.3 mm. Design PC boards and patterns considering equipment performance.
• Some connectors have positioning tabs. Design PC boards with matching positioning holes.
• Ensure required mechanical strength when soldering terminals by meeting recommended PC board pattern design dimensions.
• Control cover lay and adhesive thicknesses to prevent poor soldering. This connector has no stand-off; minimize cover lay thickness.
• For narrow pitch series, design means to fix the PC board in place to prevent it from coming off during vibrations or impacts, and to prevent loads from falling directly on soldered portions. (Example: Secure with screws). Take appropriate measures to prevent the connector from coming off when connecting PC boards.
• When mounting connectors on an FPC:
  
  • Solder detachment may occur by force to terminals when the connector soldered to FPC is mated or unmated. Handling is recommended with a reinforcing plate attached to the backside of FPC where the connector is mounted. Recommended reinforcing plate dimensions are larger than "Recommended PC board pattern" (extended dimension of one side: approx. 0.5 to 1.0 mm). Materials: glass epoxy or polyimide (thickness 0.2 to 0.3 mm) or SUS (thickness 0.1 to 0.2 mm).
  • This connector has a temporary locking structure. Mating may separate due to dropping impact depending on FPC size, weight, or bending force. Consider measures to prevent mating separation during usage.
• The narrow pitch connector series is compact and thin. Take care during mating as displacement or angled mating could damage or deform the connector.

Notes on Using Narrow pitch Connectors/High Current Connectors

Regarding the selection of the connector placement machine and the mounting procedures

• Select the placement machine considering connector height, required positioning accuracy, and packaging conditions.
• Be aware that excessive chucking force may deform the connector body or terminals.
• External forces applied during mounting may deform contact surfaces and terminals.
• Self-alignment may not be possible for certain connector sizes. Carefully position the terminal with the PC board pattern.
• Positioning bosses provide approximate alignment. For accurate positioning, use an automatic positioning machine.
• In dry conditions, static electricity may cause the product to adhere to the embossed carrier tape or cover tape. Recommended humidity is 40-60%RH. Remove static electricity with an ionizer.

Regarding Soldering

Reflow Soldering

• Measure recommended profile temperature by placing a sensor on the PC board near the connector surface or terminals. (Refer to specification for details as temperature setting differs by products.)
• Screen printing is recommended for cream solder printing.
• When setting screen opening area and PC board foot pattern area, refer to recommended PC board pattern and window size of metal mask on the specification sheet. Ensure the size of board pattern and metal mask at the base of terminals is not increased.
• Avoid providing too much solder, as it can cause miss mating due to interference at the soldering portion.
• When mounting on both sides of the PC board and the connector is on the underside, use adhesives or other means to fix the connector. (Double reflow soldering on the same side is possible.)
• Solder/flux rise and wettability vary by solder/flux type. Consider their characteristics and set reflow temperature and oxygen level.
• Do not use resin-containing solder, as it may firmly fix the contacts.
• Soldering conditions: Use recommended reflow temperature profile. Contact sales office before using a profile other than described (e.g., lead-free solder).
• Temperature profiles in this catalog are measured using resin-based PC boards. When reflow soldering on metal boards or metal tables for FPC mounting, ensure no deformation or discoloration before mounting.
• Contact sales office when using a screen-printing thickness other than recommended.

Hand Soldering

• Set soldering iron tip temperature less than values in Table A.
• Do not allow flux to spread onto connector leads or PC board, as it may rise into the connector.
• Touch soldering iron to foot pattern. After heating, apply solder wire to melt at the end of connector terminals.
• Be aware that soldering while applying load may cause improper operation.
• Thoroughly clean the soldering iron.
• Flux may get on contact surfaces. After soldering, check and clean off any solder before use.
• This is a low-profile type. Too much solder can cause miss mating due to interference. Pay attention.