PANASONIC AXK6F40347YG

Name: PANASONIC AXK6F40347YG
Brand: Shenzhen ECER Network Technology Co., Ltd.
SKU: AXK6F40347YG
Price: Negotiable USD
Availability: InStock

Manufacturer:PANASONIC

Model Number:AXK6F40347YG

Minimum Order Quantity:2000

Standard Packaging:SMD-40P

Delivery Time:1 working day

Product Details

Pitch: 0.5mm

Number Of Rows: 2

Number Of Pins: 40P

Contact Plating: Gold

Mounting Type: Surface Mount,Vertical

Product Description

Detailed Specifications & Features

Notes on Using Narrow pitch Connectors / High Current Connectors

This document provides important safety remarks, design guidelines for devices and PC board patterns, recommendations for placement machine selection and mounting procedures, and soldering instructions for narrow pitch and high current connectors. Adhering to these guidelines is crucial for preventing circuitry damage, ensuring product reliability, and avoiding accidents.

Brand Panasonic Corporation

Product Series Narrow pitch Connectors / High Current Connectors

Technical Specifications & Guidelines

Category	Item	Details / Recommendations
Safety Remarks	Usage Limits	Do not use beyond specification sheets. Usage outside rated current, dielectric strength, and environmental conditions may cause damage (heating, smoke, fire).
	Specification Review	Thorough review is appreciated to avoid accidents. Contact Panasonic if usage is out of specifications.
	Quality & Reliability	Components have a statistical failure probability. Durability varies with environment/conditions. Check under actual conditions before use. Continued use in degraded state may cause insulation deterioration, leading to heat, smoke, or fire. Implement safety designs (redundancy, fire spread prevention, malfunction prevention).
Device & PC Board Pattern Design	Board-to-Board Connection	When using board-to-board connectors, do not connect a pair of boards with multiple connectors to prevent misalignment, mating failure, or product breakage.
	Positioning Errors	Account for 0.2 to 0.3 mm error in positioning with mounting equipment when designing PC boards and patterns.
	Positioning Tabs	If connectors have embossed tabs for positioning, design PC boards with matching positioning holes.
	Mechanical Strength (Soldering)	Ensure PC board meets recommended pattern design dimensions for required mechanical strength when soldering terminals.
	PC Board Thickness (Coverlay/Adhesive)	Control coverlay and adhesive thickness to prevent poor soldering, especially as this connector has no stand-off. Minimize thickness.
	Fixing PC Board	For narrow pitch series, design means to fix the PC board (e.g., with screws) to prevent it from coming off during vibrations/impacts and to avoid loads on soldered portions.
FPC Board Mounting	Solder Detachment (FPC)	When mating/unmating, solder detachment may occur by force to terminals. Use reinforcing plate on the backside of FPC (recommended size larger than PC board pattern by 0.5-1.0mm on each side). Materials: glass epoxy, polyimide (0.2-0.3mm) or SUS (0.1-0.2mm).
FPC Board Mounting	Temporary Locking Structure	Connector mating may separate due to dropping impact. Consider measures to prevent mating separation.
Compact & Thin Design	Narrow pitch connectors are compact and thin. Take care during mating to prevent displacement or angled mating, which could damage or deform the connector.
Placement Machine & Mounting	Machine Selection	Select placement machine considering connector height, positioning accuracy, and packaging conditions.
	Chucking Force	Excessive chucking force may deform the connector body or terminals.
	External Forces	External forces during mounting may deform contact surfaces and terminals.
	Self-Alignment	Self-alignment may not be possible for all sizes. Carefully position terminals with PC board patterns.
	Positioning Bosses	Positioning bosses provide approximate alignment. Use an automatic positioning machine for accurate mounting.
	Static Electricity	In dry conditions, static electricity may cause products to adhere to carrier tape. Recommended humidity: 40%-60%RH. Use ionizer to remove static electricity.
Soldering (Reflow)	Profile Temperature Measurement	Measure recommended reflow profile temperature by placing a sensor on the PC board near the connector surface/terminals. (Refer to specification for product-specific settings).
	Cream Solder Printing	Screen printing is recommended.
	Screen Opening & Pattern Area	Refer to recommended PC board pattern and metal mask window size on the specification sheet. Do not increase the size of board pattern and metal mask at the base of terminals.
	Solder Amount	Do not provide too much solder, as it can cause miss mating due to interference at the soldering portion.
	Double-Sided Mounting	When mounting on the underside of a double-sided PC board, use adhesives or other means to fix the connector. Double reflow soldering on the same side is possible.
	Solder/Flux Characteristics	Consider solder and flux characteristics (rise, wettability) and set reflow temperature and oxygen level accordingly.
	Resin-Containing Solder	Do not use resin-containing solder, as it may firmly fix the contacts.
	Recommended Reflow Temperature Profile	Peak Temperature: 230C (Upper Limit: 260C), Preheating: 150C for 25 sec. (Lower Limit for wettability). For products other than above, refer to latest specifications.
	Board Material Variations	For resin-based PC boards, the profiles are standard. For metal boards (iron, aluminum) or metal tables for FPC mounting, check for deformation or discoloration before mounting.
	Screen-Printing Thickness	Consult Panasonic when using a screen-printing thickness other than recommended.
Soldering (Hand)	Soldering Iron Temperature	SMD type connectors: 300C within 5 sec. Other types: 350C within 3 sec.
	Flux Spread	Do not allow flux to spread onto connector leads or PC board to prevent flux rising into the connector.
	Solder Application	Touch iron to foot pattern. After heating pattern and terminal, apply solder wire to melt at the end of terminals. Apply solder wire at a small angle (up to 45 degrees).
	Load on Terminals	Avoid soldering while applying load on terminals, as it may cause improper operation.
	Soldering Iron Cleaning	Thoroughly clean the soldering iron.
	Contact Surface Check	Flux may get on contact surfaces. Check and clean off solder after soldering.
	Solder Amount (Low Profile)	For low profile types, too much solder can cause miss mating due to interference. Pay attention to the amount.
Solder Rework	Finish rework in one operation. Do not use supplementary solder flux for rework of bridges, as it may cause contact problems. Keep soldering iron tip temperature below specified limits (Table A).
Handling Single Components	Dropping	Do not drop or allow parts to fall from workbenches.
	Terminal Force	Excessive force on terminals can cause warping, coming out, or weaken solder adhesion. Handle with care.
	Insertion/Removal (Unsoldered)	Do not insert or remove the connector when it is not soldered. External pressure can weaken terminal adherence or cause unevenness.
Mating Precautions	Misaligned Mating	Do not mate connectors when mating inlets are not matched.
	Strong Pressure/Twisting	Avoid strongly pressing and twisting.
	Tilted Mating	Avoid tilted mating.
Cleaning Flux from PC Board	Cleaning Requirement	No need to clean this product. If cleaning, pay attention to prevent negative effects.
Cleaning Flux from PC Board	Solvent Choice	Keep cleaning solvent clean. Pure water passed liquid solvent is recommended. Avoid strong solvents that may dissolve molded parts or characters.
Handling PC Board After Mounting	Cutting/Bending	Be careful that soldered sections are not subjected to excessive force when cutting or bending the PC board after mounting.
Storage of Connectors	Humidity	Avoid storing in high humidity areas to prevent voids/air pockets from reflow soldering heat.
	Color Variation	Color may vary between connectors from different production lots. Slight color change from UV rays is normal and does not affect operation.
	Stacking	When storing assembled PC boards, be careful not to stack them such that connectors are subjected to excessive forces.
	Dust	Avoid storing in dusty locations, as dust accumulation can cause improper connections.
Other Notes	Electrified Connector Handling	Do not remove or insert electrified connectors (carrying current or applying voltage).
	Dropping/Mishandling	Dropping or rough mishandling may bend/damage terminals, hindering reflow soldering.
	Insertion/Removal Before Soldering	Try not to insert or remove the connector more than necessary before soldering.
	PC Board Coating	When coating PC boards after soldering, ensure the coating does not get on the connector.
	Production Lot Color Variation	Variations in product colors from different production lots are normal.
	Switching Use	Connectors are not meant for switching applications.
	Condensation	Product failures due to condensation are not covered by warranty.
Sample Orders	For sample orders to confirm proper mounting, connectors are delivered in 50-piece units in embossed tape. Consult sales representative for details. Delivery can also be made on reel by customer request.

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