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JST ZER-04V-S
JST ZER-04V-S
Manufacturer:JST
Model Number:ZER-04V-S
Minimum Order Quantity:5
Standard Packaging:P=1.5mm
Delivery Time:1 working day
Product Details
Flame Retardant Rating:
UL94V-0
Pitch:
1.5mm
Colour:
White
Number Of Rows:
1
With Wings:
Without Fins
Reference Series:
ZE
Operating Temperature:
-25℃~+85℃
Plastic Material:
PBT
Number Of PINs Per Row:
4
Number Of Positions Or Pins:
1x4P
With Locker:
Locking
Product Description
Detailed Specifications & Features
Product Overview
The ZE CONNECTOR series offers 1.5mm pitch disconnectable crimp style connectors designed for secure mating. Key features include a secure locking structure and contact locking structure, providing a reliable connection. The fork-shaped header contact ensures a good mating feel and secure operation. These connectors are suitable for applications requiring a compact and robust connection solution.
Brand
JST
Series
ZE Connector
Type
1.5mm pitch / Disconnectable Crimp style connectors
Certifications
Recognized E60389
Compliance
RoHS compliant
Packaging
Emboss Tape, Qty/ bag, Qty/ reel, Qty/ box
| Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Qty/ bag | Material |
|---|---|---|---|---|---|
| ZER-02V-S | 2 | 1.5 | 3.0 | 6,000 | PBT, UL94V-0, natural |
| ZER-03V-S | 3 | 3.0 | 4.5 | 6,000 | PBT, UL94V-0, natural |
| ZER-04V-S | 4 | 4.5 | 6.0 | 5,000 | PBT, UL94V-0, natural |
| ZER-05V-S | 5 | 6.0 | 7.5 | 3,000 | PBT, UL94V-0, natural |
| ZER-06V-S | 6 | 7.5 | 9.0 | 3,000 | PBT, UL94V-0, natural |
| ZER-07V-S | 7 | 9.0 | 10.5 | 2,000 | PBT, UL94V-0, natural |
| ZER-08V-S | 8 | 10.5 | 12.0 | 2,000 | PBT, UL94V-0, natural |
| ZER-09V-S | 9 | 12.0 | 13.5 | 2,000 | PBT, UL94V-0, natural |
| ZER-10V-S | 10 | 13.5 | 15.0 | 2,000 | PBT, UL94V-0, natural |
| ZER-11V-S | 11 | 15.0 | 16.5 | 2,000 | PBT, UL94V-0, natural |
| ZER-12V-S | 12 | 16.5 | 18.0 | 2,000 | PBT, UL94V-0, natural |
| ZER-13V-S | 13 | 18.0 | 19.5 | 2,000 | PBT, UL94V-0, natural |
| ZER-14V-S | 14 | 19.5 | 21.0 | 2,000 | PBT, UL94V-0, natural |
| ZER-15V-S | 15 | 21.0 | 22.5 | 1,500 | PBT, UL94V-0, natural |
| ZER-16V-S | 16 | 22.5 | 24.3 | 1,500 | PBT, UL94V-0, natural |
| Model No. | Applicable wire (AWG#) | Applicable wire (mm) | Insulation O.D. (mm) | Qty/ reel | Material and Finish |
|---|---|---|---|---|---|
| SZE-002T-P0.3 | 2824 | 0.080.21 | 0.761.2 | 16,000 | Copper alloy, tin-plated (reflow treatment) |
| SZE-003T-P0.3 | 3026 | 0.050.13 | 0.761.0 | 16,000 | Copper alloy, tin-plated (reflow treatment) |
| Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Qty/ box | Material and Finish |
|---|---|---|---|---|---|
| B02B-ZESK-1D | 2 | 1.5 | 6.0 | 2,496 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B03B-ZESK-1D | 3 | 3.0 | 7.5 | 1,984 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B04B-ZESK-1D | 4 | 4.5 | 9.0 | 1,664 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B05B-ZESK-1D | 5 | 6.0 | 10.5 | 1,408 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B06B-ZESK-1D | 6 | 7.5 | 12.0 | 1,216 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B07B-ZESK-1D | 7 | 9.0 | 13.5 | 1,088 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B08B-ZESK-1D | 8 | 10.5 | 15.0 | 960 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B09B-ZESK-1D | 9 | 12.0 | 16.5 | 896 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B10B-ZESK-1D | 10 | 13.5 | 18.0 | 832 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B11B-ZESK-1D | 11 | 15.0 | 19.5 | 768 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B12B-ZESK-1D | 12 | 16.5 | 21.0 | 704 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B13B-ZESK-1D | 13 | 18.0 | 22.5 | 640 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B14B-ZESK-1D | 14 | 19.5 | 24.0 | 576 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B15B-ZESK-1D | 15 | 21.0 | 25.5 | 576 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B16B-ZESK-1D | 16 | 22.5 | 27.0 | 512 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B03B-ZESK-D | 3 | 3.0 | 7.5 | 1,984 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B04B-ZESK-D | 4 | 4.5 | 9.0 | 1,664 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B05B-ZESK-D | 5 | 6.0 | 10.5 | 1,408 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B06B-ZESK-D | 6 | 7.5 | 12.0 | 1,216 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B07B-ZESK-D | 7 | 9.0 | 13.5 | 1,088 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B08B-ZESK-D | 8 | 10.5 | 15.0 | 960 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B09B-ZESK-D | 9 | 12.0 | 16.5 | 896 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B10B-ZESK-D | 10 | 13.5 | 18.0 | 832 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B11B-ZESK-D | 11 | 15.0 | 19.5 | 768 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B12B-ZESK-D | 12 | 16.5 | 21.0 | 704 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B13B-ZESK-D | 13 | 18.0 | 22.5 | 640 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B14B-ZESK-D | 14 | 19.5 | 24.0 | 576 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B15B-ZESK-D | 15 | 21.0 | 25.5 | 576 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B16B-ZESK-D | 16 | 22.5 | 27.0 | 512 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S02B-ZESK-2D | 2 | 1.5 | 6.0 | 1,872 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S03B-ZESK-2D | 3 | 3.0 | 7.5 | 1,488 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S04B-ZESK-2D | 4 | 4.5 | 9.0 | 1,248 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S05B-ZESK-2D | 5 | 6.0 | 10.5 | 1,056 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S06B-ZESK-2D | 6 | 7.5 | 12.0 | 912 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S07B-ZESK-2D | 7 | 9.0 | 13.5 | 816 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S08B-ZESK-2D | 8 | 10.5 | 15.0 | 720 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S09B-ZESK-2D | 9 | 12.0 | 16.5 | 672 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S10B-ZESK-2D | 10 | 13.5 | 18.0 | 624 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S11B-ZESK-2D | 11 | 15.0 | 19.5 | 576 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S12B-ZESK-2D | 12 | 16.5 | 21.0 | 528 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S13B-ZESK-2D | 13 | 18.0 | 22.5 | 480 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S14B-ZESK-2D | 14 | 19.5 | 24.0 | 432 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S15B-ZESK-2D | 15 | 21.0 | 25.5 | 432 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S16B-ZESK-2D | 16 | 22.5 | 27.0 | 384 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Qty/ reel | Material and Finish |
|---|---|---|---|---|---|
| SM02B-ZESS-TB | 2 | 1.5 | 7.5 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM03B-ZESS-TB | 3 | 3.0 | 9.0 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM04B-ZESS-TB | 4 | 4.5 | 10.5 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM05B-ZESS-TB | 5 | 6.0 | 12.0 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM06B-ZESS-TB | 6 | 7.5 | 13.5 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM07B-ZESS-TB | 7 | 9.0 | 15.0 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM08B-ZESS-TB | 8 | 10.5 | 16.5 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM09B-ZESS-TB | 9 | 12.0 | 18.0 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM10B-ZESS-TB | 10 | 13.5 | 19.5 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM11B-ZESS-TB | 11 | 15.0 | 21.0 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM12B-ZESS-TB | 12 | 16.5 | 22.5 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM13B-ZESS-TB | 13 | 18.0 | 24.0 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM14B-ZESS-TB | 14 | 19.5 | 25.5 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM15B-ZESS-TB | 15 | 21.0 | 27.0 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM16B-ZESS-TB | 16 | 22.5 | 28.5 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Qty/ reel | Material and Finish |
|---|---|---|---|---|---|
| BM02B-ZESS-TBT | 2 | 1.5 | 7.5 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM03B-ZESS-TBT | 3 | 3.0 | 9.0 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM04B-ZESS-TBT | 4 | 4.5 | 10.5 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM05B-ZESS-TBT | 5 | 6.0 | 12.0 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM06B-ZESS-TBT | 6 | 7.5 | 13.5 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM07B-ZESS-TBT | 7 | 9.0 | 15.0 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM08B-ZESS-TBT | 8 | 10.5 | 16.5 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM09B-ZESS-TBT | 9 | 12.0 | 18.0 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM10B-ZESS-TBT | 10 | 13.5 | 19.5 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM11B-ZESS-TBT | 11 | 15.0 | 21.0 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM12B-ZESS-TBT | 12 | 16.5 | 22.5 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM13B-ZESS-TBT | 13 | 18.0 | 24.0 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM14B-ZESS-TBT | 14 | 19.5 | 25.5 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM15B-ZESS-TBT | 15 | 21.0 | 27.0 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM16B-ZESS-TBT | 16 | 22.5 | 28.5 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
Specifications
- Current rating: 2 A AC, DC (AWG #24)
- Voltage rating: 100 V AC, DC
- Temperature range: -25C to +85C (including temperature rise in applying electrical current)
- Contact resistance: Initial value/ 20 mmax. After environmental tests/ 40 mmax.
- Insulation resistance: 500 Mmin.
- Withstanding voltage: 500 VAC/minute
- Applicable wire: Conductor size/ AWG #30 to #24, Insulation O.D./ 0.76 to 1.2 mm
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