PANASONIC AXE640124D

Safety Remarks & Usage Notes

Observe safety remarks to prevent accidents and injuries. Do not use connectors beyond specification sheets. Usage outside of specified rated current, dielectric strength, environmental conditions, etc., may cause circuitry damage via abnormal heating, smoke, and fire. Thorough specification review is appreciated; contact a sales representative for usage outside specifications. Panasonic Industry Co., Ltd. cannot guarantee quality and reliability for such cases.

Electrical components generally cause failures at a given statistical probability, and durability varies with use environments or conditions. Check actual electrical components under actual conditions before use. Continued usage in a degraded state may cause deteriorated insulation, resulting in abnormal heat, smoke, or firing. Implement safety designs and periodic maintenance, including redundancy design, fire spread prevention, and malfunction prevention, to avoid accidents resulting in injury or death, fire, or social damage.

Regarding the Design of Devices and PC Board Patterns

• When using board-to-board connectors, a pair of boards shall NOT be connected with multiple connectors to prevent mating failure or product breakage due to misaligned positions.
• Consider potential positioning errors (up to 0.2 to 0.3 mm) of mounting equipment when designing PC boards and patterns.
• If connectors have tabs for positioning, ensure PC boards have matching positioning holes.
• Meet recommended PC board pattern design dimensions for required mechanical strength when soldering connector terminals.
• Control cover lay and adhesive thicknesses to prevent poor soldering, as these connectors have no stand-off. Minimize thickness to avoid poor soldering.
• For narrow pitch series connectors, design means to fix the PC board in place (e.g., with screws and spacers) to prevent it from coming off during vibrations or impacts and to avoid loads falling directly on soldered portions.
• Take appropriate measures to prevent the connector from coming off when connecting PC boards.

When Mounting Connectors on an FPC

• To prevent solder detachment from terminals during mating/unmating, it is recommended to attach a reinforcing plate to the backside of the FPC where the connector is mounted. The reinforcing plate should be larger than the recommended PC board pattern dimensions (approx. 0.5 to 1.0 mm extended on each side). Recommended materials include glass epoxy or polyimide (0.2 to 0.3 mm thickness) or SUS (0.1 to 0.2 mm thickness).
• These connectors have a temporary locking structure. Consider measures to prevent mating separation caused by dropping impact, depending on the size, weight, or bending force of the FPC.
• The narrow pitch connector series is designed to be compact and thin. Take care during mating to prevent displacement or angled mating that could damage or deform the connector.

Regarding the Selection of the Connector Placement Machine and Mounting Procedures

• Select placement machines considering connector height, required positioning accuracy, and packaging conditions.
• Be aware that excessive chucking force may deform the connector body or terminals.
• External forces applied to contact surfaces and terminals during mounting can cause deformations.
• For larger connectors, self-alignment may not be possible; carefully position the terminal with the PC board pattern.
• Positioning bosses provide approximate alignment. For accurate positioning, an automatic positioning machine is recommended.
• In dry conditions, static electricity can cause products to adhere to the carrier tape. Recommended humidity is 40-60% RH; use an ionizer in the manufacturing process.

Regarding Soldering

Reflow Soldering

• Measure recommended reflow soldering profile temperature with a sensor on the PC board near the connector surface or terminals. Temperature settings differ by product.
• Screen printing is recommended for cream solder printing. Refer to the specification sheet for screen opening area and PC board foot pattern area, ensuring they are not increased at the base of the terminals.
• Avoid excessive solder, which can cause interference at the soldering portion during mating, leading to miss mating.
• When mounting on the underside of a double-sided PC board, use adhesives or other means to fix the connector. Double reflow soldering on the same side is possible.
• Solder/flux rise and wettability vary by type. Consider solder/flux characteristics and set reflow temperature and oxygen level accordingly.
• Do not use resin-containing solder, as it may fix the contacts firmly.

Soldering Conditions (Reflow)

• Use recommended reflow temperature profile conditions. Contact sales representative before using other profiles.
• Profiles are measured using resin-based PC boards. For metal boards or FPC mounting, check for deformation or discoloration before mounting.
• Contact sales representative for screen-printing thicknesses other than recommended.

Hand Soldering

• Set soldering iron tip temperature below the specified limits (300C within 5 sec for SMD type connectors, 350C within 3 sec for others).
• Prevent flux from spreading onto connector leads or PC boards to avoid flux rising into the connector.
• Apply solder wire to the foot pattern after heating the foot pattern and connector terminal. Apply at a small angle (up to 45 degrees).
• Avoid applying load to connector terminals during soldering to prevent improper operation.
• Thoroughly clean the soldering iron.
• Carefully check and clean off any solder from contact surfaces after soldering.
• For low-profile connectors, avoid supplying too much solder to prevent miss mating due to interference.

Solder Reworking

• Finish reworking in one operation.
• Do not use supplementary solder flux for rework of bridges to avoid contact problems.
• Keep soldering iron tip temperature below the specified limits.

Handling Single Components

• Avoid dropping or allowing parts to fall.
• Handle with care to prevent warping, detachment, or weakening of solder adhesive strength due to excessive force on terminals.
• Do not insert or remove the connector when it is not soldered, as external pressure can weaken terminal adherence or cause unevenness.

Precautions for Mating

• To prevent deformation or damage to contacts and molding, avoid mating connectors as illustrated (press-fitting without matched inlets, twisted mating, tilted mating).
• Our products have a symmetrical structure. Avoid reverse insertion, which can cause circuitry damage via abnormal heating, smoke, and fire.

Cleaning Flux from PC Board

• No cleaning is required for this product.
• If cleaning is necessary, keep cleaning solvent clean and prevent contamination of connector contacts.
• Pure water-based liquid solvent is recommended, as some strong solvents may dissolve the molded part and characters.