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Hong Cheng HCZZ0015-8

Hong Cheng HCZZ0015-8
Manufacturer:Hong Cheng
Model Number:HCZZ0015-8
Minimum Order Quantity:10
Standard Packaging:SMD,P=1.25mm
Delivery Time:1 working day
Product Details
Y-Width Of Bottom Edge On Board: 4.3mm
Reference Series: PicoBlade(MX 1.25)
Pins Structure: 1x8P
Contact Plating: Tin
Contact Material: Copper;LCP
Operating Temperature: -25℃~+70℃
Pitch: 1.25mm
Voltage Rating (Max): 125V
Number Of PINs Per Row: 8
Number Of Rows: 1
X-Length Of Bottom Edge On Board (Spacing Line): 15.1mm
Z-Height Of The Board: 4.6mm
Mounting Type: Surface Mount,Vertical
Product Description
Detailed Specifications & Features

Product Details

This document outlines the technical specifications for a component, including its electrical ratings, environmental conditions, and physical dimensions. It details various test points, plating specifications, and recommended PCB layout. Key features include high-temperature resistance and specific contact resistance values.

Contact Material

Not specified

Voltage Rating

30V (AC,DC)

Current Rating (Pin A)

0.3A AC,DC (AWG#34)

Current Rating (Pin H)

0.2A AC,DC (AWG#36)

Temperature Range

-25C ~ +85C

Contact Resistance (Max)

40m max

Insulation Resistance (Min)

100M min

Dielectric Strength

200V AC/min

Pin A (mm) B (mm) C (mm) D (mm) E (mm) F (mm) G (mm) H (mm)
02 0.60 1.36 3.00
03 1.20 1.96 3.60 0.95
01 1.80 2.56 4.20 3.55
05 2.40 3.16 4.80 4.15
04 3.00 3.76 5.40 4.75
06 3.10 3.86 5.50 4.85
07 3.60 4.36 6.00 5.35
08 1.20 1.96 6.60 5.95
09 1.80 2.56 7.20 6.55
10 0.50 1.50 6.16 7.80 7.15
DIM B BAREX: C DIM A 1.25
SECTION A=A Y45 E 60,2940 02F %
PART X0 GEMRAL s It 1 s e [ 101 =
MATED CONDITION T fr W o RECCOMENDED PCB LAYOUT s s l\\; - T
DEFAULT TOL: 0.05 XX0.20 Xx1" |l A it ik e
Y A | aprove 2R
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