JST PHR-2
PH Connector 2.0mm Pitch
This is a thin, low-profile 2.0mm pitch connector, 8.0mm in height after mounting and 4.5mm in width. It is designed to meet the demand for high-density connection of internal wires to printed circuit boards. It is compact, highly reliable, and low in cost, offering reliable contact, a fully shrouded header, and a printed circuit board retention mechanism. Available in Surface Mount Model (SMT).
Product Attributes
- Brand: JST
- Material (Wafer): PA 66, UL94V-0
- Material (Header Post): Brass, copper-undercoated, tin-plated (reflow treatment) or Copper alloy, copper-undercoated, tin-plated (reflow treatment)
- Material (Contact): Phosphor bronze, tin-plated (reflow treatment)
- Material (Solder tab): Brass, copper-undercoated, tin-plated (reflow treatment)
- Color (Wafer): Natural (white), natural (ivory), gray
- Certifications: UL Recognized E60389, CSA Certified LR20812, R75087
- Compliance: RoHS
Technical Specifications
| Model Type | Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Q'ty / box | Material and Finish | Applicable Wire (mm) | Applicable Wire (AWG) | Insulation O.D. (mm) | Q'ty / reel |
| Contact | SPH-002T-P0.5S | - | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | 0.05 0.22 | 3024 | 0.91.5 | 8,000 |
| Contact | SPH-002T-P0.5L | - | - | - | - | Phosphor bronze, tin-plated (reflow treatment) (Low insertion force type) | 0.08 0.22 | 2824 | 0.81.5 | 10,000 |
| Contact | SPH-004T-P0.5S | - | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | 0.0320.08 | 3228 | 0.50.9 | - |
| Receptacle | PHR-2 | 2 | 2.0 | 5.8 | 1,000 | PA 66, UL94V-0, natural (white) | - | - | - | - |
| Receptacle | PHR-16 | 16 | 30.0 | 33.8 | 1,000 | PA 66, UL94V-0, natural (white) | - | - | - | - |
| Header (Through-hole) | PH-K-S (Top entry) | 2 | 2.0 | 5.9 | 1,000 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | - | - | - | - |
| Header (Through-hole) | PH-K-S (Top entry) | 16 | 30.0 | 33.9 | 250 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | - | - | - | - |
| Header (Through-hole) | PH-K-S (Side entry) | 2 | 2.0 | 5.9 | 1,000 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | - | - | - | - |
| Header (Through-hole) | PH-K-S (Side entry) | 16 | 30.0 | 33.9 | 250 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | - | - | - | - |
| Header (Through-hole, Low insertion force type) | PH-KL (Top entry) | 2 | 2.0 | 5.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | - | - | - | - |
| Header (Through-hole, Low insertion force type) | PH-KL (Top entry) | 16 | 30.0 | 33.9 | 250 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | - | - | - | - |
| Header (Through-hole, Low insertion force type) | PH-KL (Side entry) | 2 | 2.0 | 5.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | - | - | - | - |
| Header (Through-hole, Low insertion force type) | PH-KL (Side entry) | 16 | 30.0 | 33.9 | 250 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | - | - | - | - |
| Header (SMT) | PH-SM4-TB (Top entry) | 2 | - | 7.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | - | - | - | - |
| Header (SMT) | PH-SM4-TB (Top entry) | 16 | - | 33.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | - | - | - | - |
| Header (SMT) | PH-SM4-TB (Side entry) | 2 | - | 7.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | - | - | - | - |
| Header (SMT) | PH-SM4-TB (Side entry) | 16 | - | 33.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | - | - | - | - |
Specifications
| Parameter | Value |
| Pitch | 2.0mm |
| Current Rating | 2A AC, DC (AWG #24) |
| Voltage Rating | 100V AC, DC |
| Temperature Range | -25C to +85C (including temperature rise in applying electrical current) |
| Contact Resistance | Initial value/ 10m max. After environmental testing/ 20m max. |
| Insulation Resistance | 1,000M min. |
| Withstanding Voltage | 800V AC/ minute |
| Applicable wire | AWG #32 to #24 |
| Applicable PC board thickness | 0.8 to 1.6mm |
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