PANASONIC AXT454124
Notes on Using Narrow Pitch Connectors
Safety Remarks: Observe safety remarks to prevent accidents and injuries. Do not use these connectors beyond the specification sheets. Usage outside of specified rated current, dielectric strength, and environmental conditions may cause circuitry damage via abnormal heating, smoke, and fire. Thorough specification review is appreciated. Contact a sales representative for usage outside of specifications. Panasonic Corporation cannot guarantee quality and reliability for such cases.
General Considerations: Electrical components generally have a statistical probability of failure. Durability varies with use environments and conditions. Check actual electrical components under actual conditions before use. Continued usage in a degraded state may result in abnormal heat, smoke, or fire. Implement safety designs and periodic maintenance, including redundancy, fire spread prevention, and malfunction prevention, to avoid accidents causing injury, death, fire, or social damage.
Device and PC Board Pattern Design: When using board-to-board connectors, do NOT connect a pair of boards with multiple connectors to avoid misalignment, mating failure, or product breakage. Consider positioning errors (0.2 to 0.3 mm) of mounting equipment when designing PC boards and patterns. If connectors have positioning tabs, design PC boards with matching positioning holes. Ensure PC board meets recommended pattern design dimensions for mechanical strength during soldering. Minimize cover lay thickness to prevent poor soldering, as connectors have no stand-off. For narrow pitch series, design means to fix the PC board in place to prevent it from coming off during vibrations or impacts and to prevent loads from falling directly on soldered portions (e.g., secure with screws and spacers).
FPC Mounting: When soldering a connector to an FPC, solder detachment may occur due to force on the terminals during mating/unmating. Reinforce the backside of the FPC where the connector is mounted with a reinforcing plate (recommended dimensions larger than PC board pattern, material like glass epoxy, polyimide, or SUS). Due to temporary locking structure, mating may separate from dropping impact; consider measures to prevent mating separation. Narrow pitch connectors are compact and thin; take care during mating to avoid displacement or angled mating that could damage or deform the connector.
Placement Machine and Mounting Procedures: Select placement machines considering connector height, positioning accuracy, and packaging. Be aware that excessive chucking force may deform the connector body or terminals. External forces during mounting can cause deformations. For connectors where self-alignment is not possible, carefully position the terminal with the PC board pattern. Positioning bosses provide approximate alignment; use an automatic positioning machine for accurate placement. In dry conditions, static electricity can cause products to adhere to carrier tape. Recommended humidity is 40-60% RH; remove static electricity with an ionizer.
Soldering: Measure reflow soldering profile temperature on the PC board near the connector. Screen printing is recommended for cream solder. Refer to specifications for screen opening area and PC board foot pattern. Avoid excessive solder to prevent mating interference. For mounting on both sides of the PC board with the connector on the underside, use adhesives or other means to fix the connector. Solder/flux rise and wettability vary by type; consider characteristics and set reflow temperature and oxygen level. Do not use resin-containing solder to prevent contacts from being firmly fixed.
| Item | Specifications | Conditions |
|---|---|---|
| Rated current | 0.3 A/pin contact (Max. 5 A at total pin contacts) | |
| Rated voltage | 60 VAC/DC | |
| Dielectric strength | 150 V AC for 1 min. | 1 mA when the specified voltage is applied for one minute. |
| Insulation resistance | Min. 1,000 M (initial) | Using 250 V DC megger (applied for 1 min.) |
| Contact resistance | Max. 90 m | Based on the contact resistance measurement method specified by JIS C 5402. |
| Insertion force | Max. 0.981 N/pin contact x pin contacts (initial) | |
| Removal force | Min. 0.0588 N/pin contact x pin contacts | |
| Ambient temperature | -55 to +85C* | No icing. No condensation. |
| Soldering heat resistance | Reflow soldering: Peak temperature: 260C or less | Satisfy initial specifications electrically and mechanically (on the surface of the PC board around the connector terminals). |
| Soldering iron | 300C within 5 sec. / 350C within 3 sec. | |
| Storage temperature | -55 to +85C (product only) / -40 to +50C (emboss packing) | No icing. No condensation. |
| Thermal shock resistance | 5 cycles | Conformed to MIL-STD-202F, method 107G. Temperature: -55C (30 min) -> 85C (30 min). |
| Humidity resistance | 120 hours. | Conformed to IEC60068-2-78. Temperature 402C, humidity 90 to 95% RH. |
| Saltwater spray resistance | Conformed to IEC60068-2-11. Temperature 352C, saltwater concentration 51%. | |
| H2S resistance | 48 hours, Temperature 402C, gas concentration 31 ppm, humidity 75 to 80% RH. | |
| Lifetime | 50 times | Insertion and removal speed of Max. 200 times/hour. |
| Unit weight | Socket: 0.04 g / Header: 0.02 g (for 20 pins) |
| Part Name | Material | Surface Treatment |
|---|---|---|
| Molded portion | LCP resin (UL94V-0) | |
| Contact portion / Terminal portion | Copper alloy | Base: Ni plating, Surface: Au plating (except the terminal tips) |
| Socket terminals (soldering terminals) | Copper alloy | Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips). Nickel barriers on portions close to solder. |
| Header terminals | Copper alloy | Base: Ni plating, Surface: Au plating (except the terminal tips) |
| Reflow Soldering Profile | Temperature | Time |
|---|---|---|
| Preheating (Lower limit) | 150C | 60-120 sec. |
| Preheating (Upper limit) | 180C | ~25 sec. (Solder heat resistance) |
| Peak temperature | 260C | ~10 sec. (Solder wettability) |