PANASONIC AXT340124

Notes on Using Narrow Pitch Connectors

These notes provide essential safety remarks and usage guidelines for narrow pitch connectors, including board-to-board and board-to-FPC applications. Adhering to these specifications is crucial to prevent circuitry damage, abnormal heating, smoke, fire, and to ensure the quality and reliability of Panasonic Corporation products.

Key Usage Guidelines:

• Do not use connectors beyond their specified ratings (current, dielectric strength, environmental conditions).
• Thorough specification review is recommended. Contact a sales representative for usage outside specifications.
• When using board-to-board connectors, avoid connecting a pair of boards with multiple connectors to prevent misalignment and product breakage.
• Design PC boards and patterns considering the performance and abilities of mounting equipment, accounting for positioning errors (up to 0.2-0.3 mm).
• If connectors have positioning tabs, design PC boards with matching positioning holes.
• Ensure PC boards meet recommended pattern design dimensions for mechanical strength during soldering.
• Minimize cover lay thickness to prevent poor soldering, as connectors have no stand-off.
• For narrow pitch series, design means to fix the PC board in place (e.g., with screws and spacers) to prevent detachment during vibrations or impacts.
• When mounting connectors on an FPC, use a reinforcing plate on the backside to prevent solder detachment from terminals.
• Consider measures to prevent mating separation due to dropping impact, especially for FPCs with temporary locking structures.
• Handle connectors with care during mating to avoid displacement or angled mating, which can cause damage or deformation.
• When selecting placement machines, consider connector height, positioning accuracy, and packaging. Avoid excessive chucking force.
• Be aware of external forces applied to contact surfaces and terminals during mounting.
• If self-alignment is not possible for larger connectors, carefully position the terminal with the PC board pattern.
• For reflow soldering, measure recommended profile temperatures near the connector.
• Use screen printing for cream solder. Ensure screen opening and PC board foot pattern areas align with specifications to avoid excess solder.
• When mounting on the underside of a PC board, use adhesives or other means for proper fixing.
• Consider solder and flux characteristics for wettability and reflow temperature settings.
• Use automatic positioning machines for accurate connector placement, especially when positioning bosses are present.
• In dry conditions, manage static electricity (recommended humidity 40-60% RH).
• Avoid resin-containing solder to prevent fixed contacts.