PANASONIC AXK6S80637YG
Product Overview
These narrow pitch connectors are designed for board-to-board and board-to-FPC applications. They offer compact and thin profiles, with specific models providing different mated heights to suit various design requirements. The connectors are engineered for reliable electrical connections, with specifications for rated current, voltage, dielectric strength, and insulation resistance. They are suitable for use in a range of environmental conditions, including varying temperatures and humidity levels. Safety remarks emphasize using connectors within specified limits to prevent damage and potential hazards like abnormal heating, smoke, and fire. Careful consideration of PC board design, mounting equipment capabilities, and proper soldering techniques is crucial for optimal performance and reliability. For FPC applications, reinforcing plates are recommended to prevent solder detachment and ensure secure connections.
| Item | Specifications | Conditions |
|---|---|---|
| Rated current | 0.5 A/pin contact (Max. 10 A at total pin contacts) | |
| Rated current | 0.5 A/pin contact (Max. 16 A at total pin contacts) | |
| Rated voltage | 60 VAC/DC | |
| Dielectric strength | 150 V AC for 1 min. | No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute. |
| Insulation resistance | Min. 1000 M (initial) | Using 500 V DC megger (applied for 1 min.) |
| Contact resistance | Max. 60 m | Based on the contact resistance measurement method specified by JIS C 5402. |
| Contact resistance | Max. 80 m | Based on the contact resistance measurement method specified by JIS C 5402. |
| Composite insertion force | Max. 0.785 N/pin contact x pin contacts (initial) | |
| Composite removal force | Min. 0.0588 N/pin contact x pin contacts | |
| Ambient temperature | -55 to +85C | No icing. No condensation. |
| Soldering heat resistance | Reflow soldering: Peak temperature: 260C or less | The initial specification must be satisfied electrically and mechanically (on the surface of the PC board around the connector terminals). |
| Soldering heat resistance | Soldering iron: 300C within 5 sec. | The initial specification must be satisfied electrically and mechanically (on the surface of the PC board around the connector terminals). |
| Soldering heat resistance | 350C within 3 sec. | The initial specification must be satisfied electrically and mechanically (on the surface of the PC board around the connector terminals). |
| Storage temperature | -55 to +85C (product only) | No icing. No condensation. |
| Storage temperature | -40 to +50C (emboss packing) | No icing. No condensation. |
| Thermal shock | Conformed to MIL-STD-202F, method 107G, 5 cycles | Insulation resistance Min. 100 M, contact resistance Max. 60 m |
| Humidity resistance | 120 hours, insulation resistance Min. 100 M, contact resistance Max. 60 m | Conformed to IEC60068-2-78, Temperature 402C, humidity 90 to 95% RH |
| Saltwater spray resistance | 24 hours, insulation resistance Min. 100 M, contact resistance Max. 60 m | Conformed to IEC60068-2-11, Temperature 352C, saltwater concentration 51% |
| HS resistance | 48 hours, contact resistance Max. 60 m | Temperature 402C, gas concentration 31 ppm, humidity 75 to 80% RH |
| Lifetime | Insertion and removal life Max. 50 times | Repeated insertion and removal speed of 200 times/hour |
| Model | Mated height | Unit weight (50 pins) | Unit weight (30 pins) |
|---|---|---|---|
| P5K | 3.0 mm | Socket: 0.17 g, Header: 0.09 g | |
| P5KS | 4.0 mm | Socket: 0.18 g, Header: 0.16 g | |
| P5KS | 4.5 mm | ||
| P5KS | 5.0 mm | ||
| P5KS | 5.5 mm | ||
| P5KS | 6.0 mm | ||
| P5KS | 6.5 mm | ||
| P5KS | 7.0 mm | ||
| P5KS | 8.0 mm | ||
| P5KS | 9.0 mm |
| Part name | Material | Surface treatment |
|---|---|---|
| Molded portion | LCP resin (UL94V-0) | |
| Contact and Post | Copper alloy | Contact portion: Base: Ni plating Surface: Au plating Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips) The terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). |
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