TE Connectivity 3-640663-1
Product Overview
This product is a PCB Terminal, specifically a PCB Pin designed for through-hole solder termination. It features pre-tin plating and is suitable for wire sizes ranging from 26 to 22 AWG and 12 to 4 mm. The terminal has a profile height of 1.35 mm from the PCB and requires a PCB hole diameter of 1.4 mm.
Product Name
BACA-AMP-158
TE Internal #
3-640663-1
Terminal Plating Material
Pre-Tin
Terminal Size
Miniature
Terminal Orientation
Straight
Contact Mating Area Plating Material
Bright
Contact Mating Area Plating Thickness
5.08 um [200 in]
Wire Insulation Support
With
Packaging Method
Box
Packaging Quantity
10000
| Product Name | PCB Hole Diameter | Wire Size (AWG) | Wire Size (mm) | Extension Below Board | PCB Thickness (Recommended) | Profile Height from PCB | Compatible Insulation Diameter (Max) | Operating Temperature Range | Solder Process Capability |
|---|---|---|---|---|---|---|---|---|---|
| BACA-AMP-158 | 1.4 mm [.055 in] | 26 22 AWG | 12 - 4 mm | 343 mm [.135 in] | 1.57 mm [.062 in] | 1.35 mm [.053 in] | 1.78 mm [.07 in] | -55 105 C [-67 221 F] | Wave solder capable to 265C |
| Product Compliance | Details |
|---|---|
| EU RoHS Directive | 2011/65/EU Compliant |
| EU ELV Directive | 2000/53/EC Compliant |
| China RoHS 2 Directive | MIIT Order No 32, 2016 No Restricted Materials Above Threshold |
| EU REACH Regulation | (EC) No. 1907/2006 Current ECHA Candidate List: JUNE 2023 (235) Candidate List Declared Against: JUNE 2023 (235) Does not contain REACH SVHC |
| Halogen Content | Low Halogen - Br, Cl, F, I < 900 ppm per homogenous material. Also BFR/CFR/PVC Free |