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TE Connectivity 925819-3

TE Connectivity 925819-3
Manufacturer:TE Connectivity
Model Number:925819-3
Minimum Order Quantity:32000
Standard Packaging:-
Delivery Time:25-42 weeks
Product Details
Contact Plating: Tin
Insulation OD: 1.02mm~1.52mm
Product Description
Detailed Specifications & Features

Product Overview

This specification covers the requirements for application of miniature AMP-IN contacts and miniature AMP-IN 2000 contacts. These contacts are designed to hold the strands of wire together so that the wire can be inserted into holes in a printed circuit (pc) board. Each contact features a wire barrel, insulation barrel, and locking lance(s). The miniature AMP-IN contact has a stabilizer barrel, which holds the contact steady during the soldering process, and the miniature AMP-IN 2000 contact has an insulation stop/positive board stop, which prevents the wire insulation from being inserted, and the contact from being over inserted, into the pc board hole. The locking lance(s) is designed to prevent the contact from backing out of the pc board hole. These requirements are applicable to automatic termination machines.

Brand
TE Connectivity
Product Line
Miniature AMP-IN contacts and Miniature AMP-IN 2000 contacts

Technical Specifications

FeatureMiniature AMP-IN ContactMiniature AMP-IN 2000 Contact
Stabilizer BarrelPresentPresent
Insulation Stop/Positive Board StopNot PresentPresent
Locking Lance(2 Places)(2 Places)
Wire Barrel SeamClosed (no strands protruding)Closed (no strands protruding)
Stabilizer Barrel CrimpF-crimp or O crimpF-crimp or O crimp
Insulation Stop/Positive Board Stop CrimpN/AMust remain in open U shape
Bellmouth (Wire Barrel)0.25 [.010]0.25 [.010]
End of Wire Conductor to Wire Barrel0.38 [.015] Max0.38 [.015] Max
Wire Barrel Seam Burr0.08 [.003] Max0.08 [.003] Max
Wire Barrel and Stabilizer Barrel Crimp HeightRefer to Figure 3Refer to Figure 3
Locking Lance Height in Stabilizer Barrel3.56 [.140] Min3.56 [.140] Min
Wire Insulation Not Crimped Between Locking Lances0.64 [.025] Min0.64 [.025] Min

Soldering Process

ProcessTemperatureTime (At Max Temperature)
Wave260C [500F]5 Seconds
Vapor Phase215C [419F]5 Minutes
Infrared Reflow230C [446F]5 Minutes

Flux Compatibility

Commercial DesignationType ActivityResidueALPHAKESTER
RMAMild NoncorrosiveNoncorrosive611186/197
Center (Activated)Medium Corrosive or NoncorrosiveCorrosive or Noncorrosive711, 809, 8111544, 1545, 1547
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