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TE Connectivity 3-2199250-3
TE Connectivity 3-2199250-3
Manufacturer:TE Connectivity
Model Number:3-2199250-3
Minimum Order Quantity:44000
Standard Packaging:-
Delivery Time:25-42 weeks
Product Description
Detailed Specifications & Features
Product Overview
This specification covers the requirements for product performance, test methods, and quality assurance provisions of the TE Connectivity Low Force Scalable Spring Finger.
Application: Used in electronic components.
Brand TE Connectivity
Origin Shanghai, China
Document ID 108-115061-1
| Specification | Type A | Type B & C | Unit |
|---|---|---|---|
| Material | SUS301 | Copper alloy | |
| Under Plating | Ni 2m MIN. | ||
| Contact Area Plating | Gold 0.5m MIN. | ||
| Soldering Area Plating | Gold Flash | ||
| Voltage Rating | 15 Max. | V | |
| Current Rating | 2.0 | A | |
| Operating Temperature Range | -30 to 85 | C | |
| Storage Temperature Range | -5 to 85 | C | |
| Storage Humidity Range | 15 to 70 | %RH | |
| Test Description | Requirement | Unit |
|---|---|---|
| Low level contact resistance (Initial) | 75 Max. (Type A) | m |
| Low level contact resistance (Initial) | 25 Max. (Type B/C) | m |
| Low level contact resistance (Final) | 100 Max. (Type B/C) | m |
| Temperature rise | 30 Max. increase of contact temperature | C |
| Damp heat Contact resistance | 50 Max. (Cu alloy) / 100 Max. (SST) | m |
| Vibration Discontinuity | <1 | s |
| Vibration Contact resistance | 50 Max. | m |
| Shock Discontinuity | <1 | s |
| Shock Contact resistance | 50 Max. | m |
| Solderability | 95% Min. solder coverage | |
| Thermal shock Contact resistance | 50 Max. (Cu alloy) / 100 Max. (SST) | m |
| Contact force at maximum working height (minimum deflection) | 0.2 Min. | N |
| Contact force at minimum working height (maximum deflection) | 1.2 Max. | N |
| Durability (Life cycle) Contact resistance | 50 Max. | m |
| Durability (Spring dynamic test) Contact resistance | 50 Max. | m |
| Peeling Strength | 3 (Type A&B) / 9 (Type C) | N |
| Push Strength | 10 Min. | N |
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