HRS DF59-4P-2C
Low Profile Interconnect System
Developed for LED applications, this system offers an ultra-low profile design that minimizes shadowing. It features a unique "Swing-lock" engagement for strong plug retention against cable pull and high current capability of 3 Amps. The floating Board-to-Board connector with "Stress free contact" allows for 0.5 mm floating in XYZ directions, enabling multiple Board-to-Board connections to minimize thermal expansion issues. It is RoHS compliant and cUL Pending.
Key Features:
- Ultra low profile design minimizes shadowing.
- Wire-to-Board, Board-to-Board, and Short-Circuit applications are compatible with a common header.
- Positive "Swing-lock" engagement provides strong plug retention.
- High current capability: 3 Amps.
- Floating Board-to-Board connector with "Stress free contact" allows 0.5 mm floating in XYZ directions.
- Multiple Board-to-Board connections minimize thermal expansion issues.
- Temperature range: -35C to 105C.
- For AWG #22: 1.2 to 1.45 mm diameter.
| Part Number | Positions | Type | Gender | Pitch (mm) | Depth (mm) | Width (mm) | Height (mm) |
|---|---|---|---|---|---|---|---|
| OFS9-45-2V(51) | 4 | Header | Female | 2.30 | 2.80 | 2.48 | 2.80 |
| OFS9-40-2FC(50) | 4 | e2B bridge | Female | 2.30 | 2.80 | 2.48 | 2.80 |
| OFS9-22pCPA | Contact | Male | 2.30 | 2.80 | 2.48 | 2.80 |
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Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. In case of consideration for using Automotive equipment / device which demand high reliability, kindly contact our sales window correspondents. HRS DRAWING FOR REFERENCE
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