JST 01P-LEBSS-TF(LF)(SN)
Product Overview
The LEB connector is a low-profile (2.7mm height) connector designed for LED lighting applications. It features a 4.0mm pitch and is suitable for board-to-board and disconnectable crimp style connections. Key advantages include an absorption misalignment mechanism (in the connector pitch direction), common PCB layout for plug and receptacle connectors, and a mechanism for preventing wrong insertion. The fork-type contact provides high contact pressure and stable performance even with PCB expansion and contraction due to heat. It is designed to accommodate the luminescence property of LED devices, achieving space saving.
Brand
JST
Product Type
LEB Connector
Pitch
4.0mm
Connection Type
Board-to-board, Disconnectable Crimp style
Height
2.7mm
Certifications
RoHS Compliant, UL Recognized E60389, Certified LR20812
Housing Material
PA 9T, UL94V-0, white (for plug/receptacle); PBT, UL94V-0, natural (for receptacle)
Contact Material
Copper alloy, copper-undercoated, tin-plated (reflow treatment)
Solder Tab Material
Copper alloy, tin-plated (reflow treatment)
Package Types
Embossed tape, Bag
| Application | Current Rating | Voltage Rating | Temperature Range | Contact Resistance (Initial) | Contact Resistance (After Environmental Testing) | Insulation Resistance | Withstanding Voltage | Applicable Wire Size | Applicable Wire Insulation O.D. |
|---|---|---|---|---|---|---|---|---|---|
| For board-to-board | 3A AC, DC | 300V AC, DC | -55C to +105C | 20m max. | 40m max. | 1,000M min. | 1,700V AC/minute | N/A | N/A |
| For disconnectable crimp style | 3A AC, DC (AWG #22) | 300V AC, DC | -55C to +105C | 20m max. | 40m max. | 1,000M min. | 1,700V AC/minute | AWG #26 to #22 | 0.95 to 1.3mm |
| Model No. | No. of Circuits | Qty / Reel | Material and Finish |
|---|---|---|---|
| 01P-LEBSS-TF | 1 | 2,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Housing: PA 9T, UL94V-0, white Solder tab: Copper alloy, tin-plated (reflow treatment) |
| 02P-LEBSS-TF | 2 | 2,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Housing: PA 9T, UL94V-0, white Solder tab: Copper alloy, tin-plated (reflow treatment) |
| 01R-LEBSS-TB | 1 | 2,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Housing: PA 9T, UL94V-0, white Solder tab: Copper alloy, tin-plated (reflow treatment) |
| 02R-LEBSS-TB | 2 | 2,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Housing: PA 9T, UL94V-0, white Solder tab: Copper alloy, tin-plated (reflow treatment) |
| Model No. | Applicable Wire Size (mm) | Applicable Wire Size (AWG#) | Insulation O.D. (mm) | Qty / Reel | Material and Finish |
|---|---|---|---|---|---|
| SLEB-001T-P0.2 | 0.13 to 0.33 | 26 to 22 | 0.950.13 | 15,000 | Copper alloy, tin-plated (reflow treatment) |
| Model No. | No. of Circuits | Qty / Bag | Material |
|---|---|---|---|
| LEBRP-01V-S | 1 | 2,000 | PBT, UL94V-0, natural |
| LEBRP-02V-S | 2 | 2,000 | PBT, UL94V-0, natural |
| Contact Machine | Crimp Applicator Dies | Crimp Applicator with Dies |
|---|---|---|
| AP-K2N | MKS-L | MK/SLEB-001-02 |
| N/A | N/A | APLMK SLEB001-02 |
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