HRS DF3EA-6P-2H(21)
Product Overview
The DF3 Series is a 2mm pitch connector designed for discrete wire connections. It is approved by UL and CSA standards. This series is suitable for general office automation equipment such as copiers and printers.
Brand
HIROSE
Series
DF3
Pitch
2mm
Certifications
UL, CSA
UL File No.
E52653
CSA File No.
LRO5109
| Item | Condition | 22 to 24AWG (Note 1) | 26 AWG | 28 AWG | Operating Temperature | Operating Humidity Range | Storage Temperature Range | Storage Humidity Range |
|---|---|---|---|---|---|---|---|---|
| Rated Current | Crimping | 3A / pin | 2A / pin | 1A / pin | ||||
| Rated Voltage | 250V AC/DC | -55 to +105C | 40 to 80% | -10 to +60C | 40 to 70% | |||
| Rated Current | UL-CSA | 3A / pin | 2A / pin (Note 5) | 1A / pin | ||||
| Rated Voltage | UL-CSA | 30V AC/DC | ||||||
| Insulation Resistance | Measured at 500V DC | 1,000M Min. | ||||||
| Withstanding Voltage | 650V AC for 1 min. | No flashover or dielectric breakdown | ||||||
| Contact Resistance | Measured at 20mV Max., 1mA | 30m Max. | ||||||
| Vibration Resistance | No electrical discontinuity of 1s or more | Frequency 10 to 55 Hz, Half amplitude 0.75 mm, 2 hours in each of 3 directions | ||||||
| Humidity Resistance | +402C, 80 to 85% RH, 96 hours | Contact Resistance: 30m Max. Insulation Resistance: 500M Min. | ||||||
| Temperature Cycle | -55C : 30 minutes +5 to +35C : 2 to 3 minutes +85C : 30 minutes +5 to +35C : 2 to 3 minutes, 5 cycles | Contact Resistance: 30m Max. Insulation Resistance: 1,000M Min. | ||||||
| Mating Durability | Tin Plating | 30 times | ||||||
| Mating Durability | Gold Plating | 50 times | ||||||
| Solder Heat Resistance | Dip Type Flow: +260C, 10sec. / Hand Soldering: +300C, for 2 sec. | No dissolution of the resin part affecting performance. | ||||||
| Solder Heat Resistance | SMT Type Reflow: Recommended in Temperature Profile / Hand Soldering: 300C for 3sec. | No dissolution of the resin part affecting performance. |
| Item | Condition | Value |
|---|---|---|
| Recommended Screen Thickness (SMT) | 0.15 to 0.2mm | |
| Board Warpage (SMT) | at the center in reference to both ends of the connector | Max. of 0.03mm |
| Recommended Soldering Conditions (DIP) | Flow Conditions with Automatic Soldering Equipment | Solder Temperature 2505C, Time within 10 sec. |
| Recommended Soldering Conditions (DIP) | Manual Soldering Conditions | Soldering Iron Temperature 29010C, Time within 2 sec. |
| Cleaning | IPA cleaning is allowed. (Contact us if using other cleaning agents.) |
Precautions
Please refer to the following documents when handling this product:
- Crimp Quality Standard (ETAD-H0958-00, ETAD-H0959-00)
- Guidelines for Wire-to-Board Connectors (ETAD-H1023-00)
This product may have slight differences in color depending on the production lot, which does not affect performance. Black spots may appear on the mold resin, but this also does not affect the product quality.
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