JAE Electronics WP27D-S050VA3-R15000
Product Overview
The WP27D Series is a 0.35mm pitch, low-profile stacking board-to-board (FPC) connector designed for high-density mounting in slim and compact information communication devices such as smartphones. It features special hold-downs that can serve as power supply terminals, capable of handling up to 3.0A each. The connector incorporates a protective structure to prevent insulator damage during misalignment and offers a clear click feeling for improved workability. It supports high-speed data transmission, including 10 Gbps, MIPI, USB3.1 Gen2, and PCIe Gen3.
Product Attributes
- Brand: JAE
- Series: WP27D
- Origin: Japan Aviation Electronics Industry, Ltd.
- Certifications: RoHS Compliant, Pb-free
Technical Specifications
| Specification | Value |
|---|---|
| Pitch | 0.35mm |
| Stacking Height | 0.7mm |
| Number of Rows | 2 |
| Number of Contacts | 10, 24, 30, 34, 38, 40, 50, 60 |
| Contact Resistance (Signal terminal) | 70m max. (initial) |
| Contact Resistance (Hold-down for power supply) | 20m max. (initial) |
| Dielectric Withstanding Voltage | AC250Vr.m.s for 1 minute |
| Insulation Resistance | 100M min. (initial) |
| Life Time | 30 mating cycles |
| Operating Temperature Range | -40C to +85C |
| Rated Current (Signal terminal) | AC, DC 0.3A per terminal |
| Rated Current (Hold-down for power supply) | AC, DC 3.0A per terminal |
| Rated Voltage | AC, DC 50V |
| Total Insertion Force | 1.5N x (n+4) max. (n: No. of pos.) |
| Total Extraction Force | 0.15N x (n) min. (n: No. of pos.) |
| Signal Transmission Rate | Supports 10 Gbps (MIPI, USB3.1 Gen2, PCIe Gen3) |
| Contact Material | Copper alloy with Au plating |
| Insulator Material | Heat-resistant plastic |
| Hold-down Material | Copper alloy with Au plating |
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