TE Connectivity 1-5086147-0

Product Overview

The AMPMODU Level V IDC connectors offer a cost-effective solution for discrete wire connections, compatible with modern telecommunications packaging. These connectors are designed to mate with 0.025 [0.64] square posts on 0.125 x 0.125 [3.18 x 3.18] centers. They feature double-row housings preloaded with insulation displacement receptacle contacts, snap-on hermaphroditic covers, and a comprehensive range of mass termination tooling for various production needs. Connectors can be stacked end-to-end or side-to-side, maintaining the 0.125 x 0.125 [3.18 x 3.18] centerline spacing. Covers are available with or without cable tie paddles and snap on after termination. The receptacle contacts utilize Tyco Electronics' insulation displacement crimp technique for high-quality, low-cost terminations. Key features of the contacts include dual cantilever beams for redundant interface with mating posts, an integral post stop to control mating depth and protect crimp terminations, and a wire support crimp for strain relief. Contacts are made of high conductivity copper alloy and are duplex plated.

The 0.031 x 0.062 [0.79 x 1.57] interconnection system is an industry standard for modular packaging, designed for board-to-board and board-to-wire or cable applications. It provides millions of reliable interconnections and mating cycles, meeting the requirements for most modular power supply packaging. Board-mounted receptacles and assemblies are available in various geometries for perpendicular, parallel, and stacking interconnections. Machine-applied terminations ensure low applied costs for production requirements. Crimp snap-in receptacles for 26-18 AWG [0.12 0.9mm2] wire offer excellent discrete wire terminations.