TE Connectivity 1544426-2
Product Overview
This Single-In-Line (SIL) leadframe features a 1.27 mm [.05 in] centerline and is plated with Tin over Nickel. Designed for board mounting, it utilizes a through-hole solder termination method to the PCB and accepts a PCB thickness of .63 mm [.025 in]. The leadframe has a hold-down feature without a standoff and a height of 1 mm [.039 in].
Product Attributes
- Brand: TE Connectivity
- Leadframe Type: Single-In-Line (SIL)
- Leadframe Plating Material: Tin over Nickel
- Contact Base Material: Phosphor Bronze
- EU RoHS Compliance: Compliant
- EU ELV Compliance: Compliant
- China RoHS 2 Directive: MIIT Order No 32, 2016
- Halogen Content: Low Halogen - Br, Cl, F, I < 900 ppm per homogenous material. Also BFR/CFR/PVC Free
- Solder Process Capability: Wave solder capable to 265C
Technical Specifications
| Part Number | Centerline (Pitch) | PCB Thickness (Accepted) | Standoff Height | Leadframe Pin Length | Leadframe Clip Length | Leadframe Thickness | Leadframe Width | Leadframe Gap Size | Packaging Quantity |
|---|---|---|---|---|---|---|---|---|---|
| 1544426-2 | 1.27 mm [.05 in] | .63 mm [.025 in] | 1 mm [.039 in] | 9.7 mm[.382 in] | 1.5 mm[.059 in] | .25 mm[.01 in] | 18.1 mm[.712 in] | .52 mm[.02 in] | 80000 |
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