TE Connectivity 1367147-1
Product Overview
This drawing details a COVER for SFP (Small Form-factor Pluggable) components. It is a controlled document from TE Connectivity, designed for application specifications and product specifications.
Brand
TE ConnectivityDrawing Number
1367147Material
THERMOPLASTIC MOLDING COMPOUND. TIN PLATING OVER COPPER PLATING.Finish
TIN PLATING OVER COPPER PLATING.Logo
AMP LOGOFeature
OPTIONAL GATE RECESS FEATURE.| Part Number | Quantity | Material | Finish | AMP Logo | Notes | Dimensions (mm) |
|---|---|---|---|---|---|---|
| 1367147-1 | 1 | THERMOPLASTIC MOLDING COMPOUND | TIN PLATING OVER COPPER PLATING | YES | OBSOLETE. | 14.6 MAX H x 10.2 MAX W x 10.4 MAX D |
| 1367147-2 | 1 | THERMOPLASTIC MOLDING COMPOUND | TIN PLATING OVER COPPER PLATING | YES | 14.6 MAX H x 10.2 MAX W x 10.4 MAX D | |
| 1367147-3 | 2 | THERMOPLASTIC MOLDING COMPOUND | TIN PLATING OVER COPPER PLATING | NO | 14.6 MAX H x 10.2 MAX W x 10.4 MAX D |
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