Amphenol UE36-E16200-32BB1

Name: Amphenol UE36-E16200-32BB1
Brand: Shenzhen ECER Network Technology Co., Ltd.
SKU: UE36-E16200-32BB1
Price: Negotiable USD
Availability: InStock

Brand Name:UE36-E16200-32BB1

Model Number:UE36-E16200-32BB1

Minimum Order Quantity:2

Standard Packaging:-

Delivery Time:3-5工作日

Product Description

Detailed Specifications & Features

Product Overview

The Amphenol ICC QSFP DD interconnect system is a high-performance solution designed for demanding serial applications. Featuring a 76-position, 0.8mm pitch connector, each port supports up to 400Gb/s aggregate bandwidth through an 8 x 50Gb/s electrical interface. This system offers backward compatibility with QSFP28 modules, allowing them to connect to 4 of the 8 electrical channels. It is a leading multi-lane pluggable form factor widely adopted in Ethernet, Fibre Channel, and InfiniBand networks. The QSFP DD system enables aggregate bandwidths of 200G and 400G per port, and up to 14.4Tb/s in a single switch slot, supporting various configurations including single (1x1), ganged (1xN), and stacked (2xN) options. It is compatible with passive & active copper and optical solutions, including DAC and optical transceivers, and meets or exceeds MSA-supported standard interface specifications. Available with multiple heat sink options for optimized thermal management, the system is also RoHS compliant.

Product Attributes

Brand: Amphenol ICC
Product Family: QSFP DD
Housing Material: Black color, glass reinforced, lead free solder reflow process compatible thermo plastic
Contacts Base Material: High performance copper alloy
Solder Tails Plating: Matte tin
Mating Area Plating: Gold
Resonance Dampening Feature: Conductive polymer
RoHS Compliant: Yes
Halogen Free: Yes

Technical Specifications

Specification	Details
General
Connector Type	QSFP DD
Number of Positions	76
Pitch	0.8mm
Aggregate Bandwidth per Port	Up to 400Gb/s (8 x 50Gb/s)
Modulation Support	25Gb/s NRZ or 56Gb/s PAM4
Backward Compatibility	QSFP28 modules (connects to 4 of 8 channels)
Supported Solutions	Passive & active copper and optical (DAC, short and long range)
MSA Standard	Supported
Configurations	Single (1x1), Ganged (1xN), Stacked (2xN)
Target Markets/Applications	Cellular infrastructure, Network Interface Cards, SAN-Storage Attached Networks, Hubs, Switch, Servers, Test and Measurement Equipment
Mechanical Performance
Durability	100 mating cycles
Mating Force	90N max.
Unmating Force (Cage)	50N max.
Insertion Force to PCB (Cage)	780N (1x1 port), 1000N (1x2 Ports), 1700N (1x4 Ports), 2400N (1x6 Ports), 3000N (2x1 Ports)
PCB Thickness (Cage, 1xN)	1.44mm min.
Belly to Belly (Cage, 1xN)	2.35mm min.
Electrical Performance
Operating Voltage per Contact	30VDC
Operating Current per Signal Contact	0.5A
Differential Impedance	100 +/- 10
Environmental
Operating and Storage Temperature	-40 to +85C
Tooling Information
Cage Mounting	Thru bezel
EMI Options	Spring fingers
Cage Configurations	1xN (N=1,2,3,4,5,6), 2xN (N=1,2)
Termination Options	SMT, SMT with solder rings, All Press Fit Pins
Heat Sink Options	Multiple options available (e.g., Fin pin style, Square pin style with various heights and airflow directions)
Cage Plating Options	Nickel, Matte Tin (with Nickel Under Layer for Solder Pins), Nickel-Silver Copper
Plating for Mating Contact Options	0.76m (30in) min gold (GXT), 0.38m (15in) min gold
Light Pipe Option	Standard (No light pipe), Dual Barrel Light Pipe
Venting Options	Standard (No Indicators, Large Vent Holes), Small top opening
Packaging Options	Tape and Reel, Tray, Tray with dust cover, Items shipped assembled (Tray)

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