TE Connectivity 2324869-2
Product Overview
The OSFP SMT Connector Assembly is a high-speed surface mount interconnect solution designed for data communication applications. It features a robust design with optional retention washers for enhanced mechanical stability. The assembly is optimized for host board applications, including single-sided and belly-to-belly configurations.
| Part Number | Retention Washer | Finish (Contact Area) |
|---|---|---|
| 2324869-1 | Without | Gold Flash over PdNi (0.76um min) |
| 2324869-2 | With | Gold Flash over PdNi (0.76um min) |
| 2324869-3 | Without | 0.76um min Gold Plating |
| 2324869-4 | With | 0.76um min Gold Plating |
| Material Component | Material Specification |
|---|---|
| Housing/Organizer/Overmold | LCP, Black |
| Contacts | Copper Alloy |
| Retention Washer | Copper Alloy |
| Underplating | 1.27um min Nickel over all |
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