TE Connectivity 1551892-1

QSFP28/56 and zQSFP+ Interconnects

TE Connectivitys (TE) Quad Small Form-Factor Pluggable (QSFP28/56) and z-Quad Small Form-Factor Pluggable Plus (zQSFP+) interconnects offer increased data rates of 28 Gbps NRZ and 56 Gbps PAM-4 in an industry standard, scalable design. They allow for backwards compatibility with QSFP+ cables and transceivers, providing a simple upgrade path from 10 Gbps to 28 Gbps and 56 Gbps. The complete portfolio delivers a large range of simple and customizable design options. TEs zQSFP+ interconnects are dual sourced with Molex, LLC.

Key Features

• Data transfer rates of 28 Gbps NRZ and 56 Gbps PAM-4
• Supports Ethernet and InfiniBand (IB) Enhanced Data Rate (EDR) requirements
• Supports single, dual and quad channel implementations

Applications

• Network interface
• Switches
• Servers
• Routers
• Wireless Base Stations
• Test and Measurement Equipment

Applications By Protocol

• 50, 100 and 200 Gigabit Ethernet
• 100 Gbps Infiniband (IB) Enhanced Data Rate (EDR) requirements
• 128G Fibre Channel
• 25G/50G Consortium
• 28G NRZ and 56G PAM-4

Key Benefits

• Superior signal integrity and EMI protection through 56 Gbps
• Industry standard interface
• Backwards compatible with QSFP+ cables and transceivers
• Comprehensive product portfolio

Enhanced QSFP28/56 and zQSFP+ Cages

Lower Assembly Insertion Force

Help increase assembly throughput by providing a 55% reduction in force needed to insert the line card into the front bezel. The reduction in insertion force makes assembly easier, faster, and reduces the risk for damage.

Improved EMI Performance

EMI sealing enhancements on these new cages provide 10 dB EMI performance improvement over current QSFP28 products. High-performance springs are both flexible and strong, more fully sealing the connector from EMI.

Thermally Enhanced Lower Port Cooling

Internal riding heatsink in the separator plate area provides enhanced cooling to the lower ports and a 12-15C improvement over standard stacked zQSFP+ cages.

Optimized Airflow

External riding heatsinks on the upper port are optimized for airflow direction. Air vent holes allow for air to pass through and exit out the sides and rear of the cage.

Intel Omni-Path Architecture Stacked Belly-to-Belly

Designed for Intel Omni-Path Architecture (OPA) switch architectures and OPA NIC cards. Designing with these cages allows access to proven technology to support high-performance applications. Certain stacked cages can be used in belly-to-belly applications to support high-density 2RU+ box designs and switch designs using next-gen 48 and 64 silicon ports. Using a stacked belly-to-belly design enables a single PCB architecture versus two PCBs per line card, saving significant system costs.