TE Connectivity 2325080-4

Product Overview

This specification covers the requirements for application of the single port and ganged OSFP cage assemblies utilized to interconnect OSFP fiber optic or copper transceiver modules to host printed circuit boards. The OSFP cage assembly is a pre-assembled unit available in a 1X1, 1X2 and 1X4 configurations. Product styles include iterations that contain bezel EMI springs or no EMI springs. In addition, light pipe kits for each configuration are available. This specification also covers the requirements for application of the single port OSFP Riding Heat Sink (OSFP-RHS) cage assemblies, heat sink and EMI/dust cover utilized to interconnect OSFP-RHS fiber optic or copper transceiver modules to host printed circuit boards. The OSFP-RHS cage assemblies are available in single port 1X1 configurations. All configurations are available with, or without, optional heat sinks in different heights (PCI, SAN, NETWORKING, and CUSTOMIZED). The cage assembly features compliant pin contacts for mechanical retention to the pc board and to provide EMI suppression. It also features thermal vent holes, and either EMI springs or no EMI springs. In addition, the cage assembly ports contain latch tabs used to retain the transceiver modules during operation. A dust cover for each port may be used when a module is not mated to the cage assembly to prevent contaminants from entering the chassis. Alternatively, an EMI plug is available for each empty port to prevent EMI leakage. The cage assembly is designed to be inserted thru a bezel after being seated on the pc board. The cage is used in conjunction with a 60 position SMT OSFP receptacle, which is soldered to the pc board before the cage is pressed on.