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Amphenol UE76-3GA20-3600T

Amphenol UE76-3GA20-3600T
Manufacturer:Amphenol
Model Number:UE76-3GA20-3600T
Minimum Order Quantity:500
Standard Packaging:-
Delivery Time:4-6 working days
Product Description
Detailed Specifications & Features

Product Overview

Amphenol ICC's UltraPort SFP+ interconnect system is a low-cost, compact, and flexible solution designed for 28Gb/s applications. It comprises a 20-position hot-swappable I/O connector housed in a metal cage mounted to a host PCB. This system offers backward compatibility for next-generation Ethernet and Fibre Channel applications. The UltraPort SFP+ connector shares the same mating interface and EMI cage dimensions as the SFP+ form factor, ensuring seamless integration. Cages are designed to accommodate various board thicknesses and assembly processes for cost-optimized server and switch applications. The connector accepts multiple transceivers per INF-8081, enabling combined transmit and receive functions in a compact format. Stacked versions (2xN) feature a 2-row cage with integrated connectors. A variety of cage configurations are available in press-fit or solder tail versions, with enhanced transceiver mating tabs.

Key Features & Benefits:

  • Electrical interface employs 1 lane operating up to 28Gb/s per channel.
  • Supports next-generation Ethernet and Fibre Channel applications.
  • Shares the same unique mating interface and EMI cage dimensions as the SFP+ form factor, supporting previous generation systems.
  • Accepts multiple transceivers per INF-8081 to support various application requirements.

Target Markets/Applications:

  • Cellular Infrastructure
  • Telecommunications Hardware
  • Servers
  • Storage
  • Test and Measurement Equipment
  • Medical Diagnostic Equipment

Brand

Amphenol ICC

Product Line

UltraPort SFP+

Material - Housing

Black color, Glass reinforced, Lead Free Solder Reflow Process Compatible Thermo Plastic

Material - Contacts Base

Phosphor Bronze

Plating - Solder Tails

Matte tin or gold flash options

Plating - Mating Area

Gold

Resonance Dampening Feature

Conductive Polymer

Certifications

RoHS & Halogen-Free

Specification Value Unit
Durability 250 mating cycles
Mating Force 40 N max.
Contact Normal Force 0.3 N min./PIN
PCB Thickness (Single Side Mount Cage) 1.57 mm (0.062 in.)
PCB Thickness (Belly to Belly Cage) 3.00 mm (0.118 in.)
Unmating Force (Cage) 12.5 N max.
Insertion Force to PCB (Cage - 2 port) 1000 N
Insertion Force to PCB (Cage - 4 port) 2100 N
Insertion Force to PCB (Cage - 6 port) 3000 N
Operating Voltage 30 VDC per contact
Operating Current 0.5 A per contact
Differential Impedance 100 +/- 10
Operating Temperature -55 to +85 C
Storage Temperature -55 to +85 C
Configuration Type N Value Range
1xN 1, 2, 3, 4, 5, 6, 8
2xN 1, 2, 4, 5, 6, 8, 12
Option Code Description Plating - Mating Area Plating - Termination
2 30 Gold at Mating Area 30 (0.76 m) Gold Gold Flash
3 30 Gold at Mating Area 30 (0.76 m) Gold 3.0-7.62 m Matte Tin
5 15 Gold at Mating Area 15 (0.38 m) Gold Gold Flash
6 15 Gold at Mating Area 15 (0.38 m) Gold 3.0-7.62 m Matte Tin
Cage Option Description Plating PCB Mounting EMI Chassis Grounding Number of Ports in Row 1 Number of Ports in Row 2 (for 2xN)
U77 Cage with Extra Bottom Spring Fingers, No Bottom Mid G-Pins 2 (Nickel), 3 (Matte Tin), 6 (Sliver-Nickel - No Plating) Various Options - Consult Factory 4 (Gasket), 6 (Spring Finger) 1 (1x1), 2 (1x2), 3 (1x3), 4 (1x4), 5 (1x5), 6 (1x6), 8 (1x8) N/A
UE86 Stacked SFP+ 6 (Pre-Plating) 2 (Standard Press-Fit Pins) 4 (Gasket), 6 (Spring Fingers) 2 (2x1), 2 (2x2), 3 (2x3), 4 (2x4), 5 (2x5), 6 (2x6), 8 (2x8), 12 (2x12) 20
Packaging Option Description
T Tape & Reel
1 Tray
Style Description
A Ganged Cage (One Row)
C Ganged Cage with Light Pipe (2 per port)
D Ganged Cage with Light Pipe (1 per port)
E One Row Cage and Heat Sink Combo
N One Row Cage and Heat Sink Combo (2 Light Pipes per port)
Connector Option Mounting Type Heat Sink & Light Pipe Option Dust Cover Option
3GA 3rd Generation HSIO 1 (No Heat Sink / Light Pipe) 0 (Without Dust Cover), D (With Dust Cover)
UE76 3GA 20 X 6 0 0 T 3G (3rd Generation) X (Various Options Available - Consult Factory)
3G 3rd Generation 3G (3rd Generation) 0 (Without Dust Cover), D (With Dust Cover)
UE86 3X X X 2 0 X X X 6 1 1 (No Heat Sink / Light Pipe) 0 (Without Dust Cover), D (With Dust Cover)
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