Amphenol UE76-3GA20-3600T
Product Overview
Amphenol ICC's UltraPort SFP+ interconnect system is a low-cost, compact, and flexible solution designed for 28Gb/s applications. It comprises a 20-position hot-swappable I/O connector housed in a metal cage mounted to a host PCB. This system offers backward compatibility for next-generation Ethernet and Fibre Channel applications. The UltraPort SFP+ connector shares the same mating interface and EMI cage dimensions as the SFP+ form factor, ensuring seamless integration. Cages are designed to accommodate various board thicknesses and assembly processes for cost-optimized server and switch applications. The connector accepts multiple transceivers per INF-8081, enabling combined transmit and receive functions in a compact format. Stacked versions (2xN) feature a 2-row cage with integrated connectors. A variety of cage configurations are available in press-fit or solder tail versions, with enhanced transceiver mating tabs.
Key Features & Benefits:
- Electrical interface employs 1 lane operating up to 28Gb/s per channel.
- Supports next-generation Ethernet and Fibre Channel applications.
- Shares the same unique mating interface and EMI cage dimensions as the SFP+ form factor, supporting previous generation systems.
- Accepts multiple transceivers per INF-8081 to support various application requirements.
Target Markets/Applications:
- Cellular Infrastructure
- Telecommunications Hardware
- Servers
- Storage
- Test and Measurement Equipment
- Medical Diagnostic Equipment
Brand
Amphenol ICC
Product Line
UltraPort SFP+
Material - Housing
Black color, Glass reinforced, Lead Free Solder Reflow Process Compatible Thermo Plastic
Material - Contacts Base
Phosphor Bronze
Plating - Solder Tails
Matte tin or gold flash options
Plating - Mating Area
Gold
Resonance Dampening Feature
Conductive Polymer
Certifications
RoHS & Halogen-Free
| Specification | Value | Unit |
|---|---|---|
| Durability | 250 | mating cycles |
| Mating Force | 40 | N max. |
| Contact Normal Force | 0.3 | N min./PIN |
| PCB Thickness (Single Side Mount Cage) | 1.57 | mm (0.062 in.) |
| PCB Thickness (Belly to Belly Cage) | 3.00 | mm (0.118 in.) |
| Unmating Force (Cage) | 12.5 | N max. |
| Insertion Force to PCB (Cage - 2 port) | 1000 | N |
| Insertion Force to PCB (Cage - 4 port) | 2100 | N |
| Insertion Force to PCB (Cage - 6 port) | 3000 | N |
| Operating Voltage | 30 | VDC per contact |
| Operating Current | 0.5 | A per contact |
| Differential Impedance | 100 +/- 10 | |
| Operating Temperature | -55 to +85 | C |
| Storage Temperature | -55 to +85 | C |
| Configuration Type | N Value Range |
|---|---|
| 1xN | 1, 2, 3, 4, 5, 6, 8 |
| 2xN | 1, 2, 4, 5, 6, 8, 12 |
| Option Code | Description | Plating - Mating Area | Plating - Termination |
|---|---|---|---|
| 2 | 30 Gold at Mating Area | 30 (0.76 m) Gold | Gold Flash |
| 3 | 30 Gold at Mating Area | 30 (0.76 m) Gold | 3.0-7.62 m Matte Tin |
| 5 | 15 Gold at Mating Area | 15 (0.38 m) Gold | Gold Flash |
| 6 | 15 Gold at Mating Area | 15 (0.38 m) Gold | 3.0-7.62 m Matte Tin |
| Cage Option | Description | Plating | PCB Mounting | EMI Chassis Grounding | Number of Ports in Row 1 | Number of Ports in Row 2 (for 2xN) |
|---|---|---|---|---|---|---|
| U77 | Cage with Extra Bottom Spring Fingers, No Bottom Mid G-Pins | 2 (Nickel), 3 (Matte Tin), 6 (Sliver-Nickel - No Plating) | Various Options - Consult Factory | 4 (Gasket), 6 (Spring Finger) | 1 (1x1), 2 (1x2), 3 (1x3), 4 (1x4), 5 (1x5), 6 (1x6), 8 (1x8) | N/A |
| UE86 | Stacked SFP+ | 6 (Pre-Plating) | 2 (Standard Press-Fit Pins) | 4 (Gasket), 6 (Spring Fingers) | 2 (2x1), 2 (2x2), 3 (2x3), 4 (2x4), 5 (2x5), 6 (2x6), 8 (2x8), 12 (2x12) | 20 |
| Packaging Option | Description |
|---|---|
| T | Tape & Reel |
| 1 | Tray |
| Style | Description |
|---|---|
| A | Ganged Cage (One Row) |
| C | Ganged Cage with Light Pipe (2 per port) |
| D | Ganged Cage with Light Pipe (1 per port) |
| E | One Row Cage and Heat Sink Combo |
| N | One Row Cage and Heat Sink Combo (2 Light Pipes per port) |
| Connector Option | Mounting Type | Heat Sink & Light Pipe Option | Dust Cover Option |
|---|---|---|---|
| 3GA | 3rd Generation HSIO | 1 (No Heat Sink / Light Pipe) | 0 (Without Dust Cover), D (With Dust Cover) |
| UE76 | 3GA 20 X 6 0 0 T | 3G (3rd Generation) | X (Various Options Available - Consult Factory) |
| 3G | 3rd Generation | 3G (3rd Generation) | 0 (Without Dust Cover), D (With Dust Cover) |
| UE86 | 3X X X 2 0 X X X 6 1 | 1 (No Heat Sink / Light Pipe) | 0 (Without Dust Cover), D (With Dust Cover) |