Amphenol UE36-B16200-06A4A
Product Overview
The Amphenol ICC QSFP DD interconnect system is a high-speed serial solution designed for demanding applications. It features a 76-position, 0.8mm pitch connector that supports up to 400Gb/s aggregate bandwidth per port through an 8 x 50Gb/s electrical interface. The system offers backward compatibility with QSFP28 modules, allowing them to connect to 4 of the 8 electrical channels. This multi-lane pluggable form factor is a leading industry standard for Ethernet, Fibre Channel, and InfiniBand applications, enabling aggregate bandwidths of up to 14.4Tb/s in a single switch slot. The system supports various configurations including single (1x1), ganged (1xN), and stacked (2xN) connector and cage options, as well as passive & active copper and optical solutions. It is designed to meet or exceed MSA standards and is RoHS compliant.
Product Attributes
- Brand: Amphenol ICC
- Product Line: QSFP DD
- Certifications: RoHS compliant, Halogen free
Technical Specifications
| Specification | Details |
|---|---|
| Connector Type | QSFP DD (Double Density) |
| Number of Positions | 76 |
| Pitch | 0.8mm |
| Aggregate Bandwidth per Port | Up to 400Gb/s |
| Electrical Interface | 8 x 50Gb/s |
| Modulation Support | 25Gb/s NRZ or 56Gb/s PAM4 |
| Backward Compatibility | QSFP28 modules (connects to 4 of 8 channels) |
| Aggregate Bandwidth per Switch Slot | Up to 14.4Tb/s |
| Ports per Switch Slot | 36 ports QSFP DD |
| Supported Solutions | Passive & active copper and optical (DAC, short and long range) |
| Connector Configurations | Single (1x1), Ganged (1xN), Stacked (2xN) |
| MSA Standard | Supported |
| Material - Housing | Black color, glass reinforced, lead free solder reflow process compatible thermo plastic |
| Material - Contacts Base | High performance copper alloy |
| Plating - Solder Tails | Matte tin |
| Plating - Mating Area | Gold (0.76m/30in min, 0.38m/15in min options) |
| Resonance Dampening | Conductive polymer |
| Durability | 100 mating cycles |
| Mating Force (Connector) | 90N max. |
| PCB Thickness (Cage) | 1.44mm min. for single-mounted (1xN) |
| Belly to Belly (Cage) | 2.35mm min. for 1xN |
| Unmating Force (Cage) | 50N max. |
| Insertion Force to PCB (Cage) | 780N (1x1), 1000N (1x2), 1700N (1x4), 2400N (1x6), 3000N (2x1) |
| Operating Voltage | 30VDC per contact |
| Operating Current | 0.5A per signal contact |
| Differential Impedance | 100 +/- 10 |
| Operating Temperature | -40 to +85C |
| Storage Temperature | -40 to +85C |
| Cage Mounting | Thru bezel |
| EMI Options | Spring fingers |
| Cage Configurations | 1xN (N=1,2,3,4,5,6), 2xN (N=1,2) |
| Heat Sink Options | Multiple options available (Standard/None, Fin style, Square pin style) |
| Termination Options | SMT, SMT with solder rings, Press Fit |
| Light Pipe Option | Standard (No light pipe), Dual Barrel Light Pipe |
| Packaging | Tape and Reel, Tray, Tray with dust cover |
| Target Markets/Applications | Cellular infrastructure, Network Interface Cards, SAN-Storage Attached Networks, Hubs, Switch, Servers, Test and Measurement Equipment |
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